SCHEMBL2269280

SCHEMBL2269280

CCC(C)[SiH2]Cl

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3482079 0.73
SCHEMBL436728 0.69
SCHEMBL27961691 0.69 TSHR (0.38)
SCHEMBL3481925 0.69
SCHEMBL1315546 0.67 TSHR (0.30)
SCHEMBL27493569 0.67
SCHEMBL2272411 0.67
Ammonia Solution, Strong SCHEMBL21802589 0.67 TSHR (0.35)
SCHEMBL14606212 0.67
SCHEMBL3266717 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 406 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117210798-A Method for depositing metal-free ALD silicon nitride films using halide-based precursors 朗姆研究公司 2023-12-12 CN claimed
US-10526435-B2 Method for manufacturing hydrogenated polymer KURARAY CO., LTD. (JP) 2020-01-07 US claimed
EP-3162816-B1 METHOD FOR MANUFACTURING HYDROGENATED POLYMER KURARAY CO (JP) 2019-01-02 EP claimed
US-20170204214-A1 METHOD FOR MANUFACTURING HYDROGENATED POLYMER KURARAY CO., LTD. (JP) 2017-07-20 US claimed
US-20170178899-A1 DIRECTIONAL DEPOSITION ON PATTERNED STRUCTURES LAM RESEARCH CORPORATION 2017-06-22 US claimed
EP-3162816-A1 METHOD FOR MANUFACTURING HYDROGENATED POLYMER Kuraray Co., Ltd. (JP) 2017-05-03 EP claimed
US-20260090294-A1 DOPED SILICON OR BORON LAYER FORMATION LAM RES CORP (US) 2026-03-26 US disclosed
US-20260090293-A1 SEMICONDUCTOR STACKS AND PROCESSES THEREOF LAM RES CORP (US) 2026-03-26 US disclosed
US-12588475-B2 High selectivity doped hardmask films LAM RESEARCH CORPORATION (US) 2026-03-24 US disclosed
US-20260076110-A1 HYBRID ATOMIC LAYER DEPOSITION LAM RES CORP (US) 2026-03-12 US disclosed
US-20260047361-A1 METHOD AND APPARATUS FOR ATOMIC LAYER DEPOSITION USING MULTIPLE CHAMBERS NATIONAL TSING HUA UNIVERSITY (TW) 2026-02-12 US disclosed
US-20250385088-A1 BACKSIDE LAYER FOR A SEMICONDUCTOR SUBSTRATE LAM RES CORP (US) 2025-12-18 US disclosed
US-20250372367-A1 DEPOSITION AND ETCH OF SILICON-CONTAINING LAYER LAM RES CORP (US) 2025-12-04 US disclosed
US-8404584-B2 Method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2013-03-26 US disclosed
WO-2011130397-A2 IMPROVED SILICON NITRIDE FILMS AND METHODS NOVELLUS SYSTEMS, INC. (US) 2011-10-20 WO disclosed
US-20110256734-A1 SILICON NITRIDE FILMS AND METHODS NOVELLUS SYSTEMS, INC. 2011-10-20 US disclosed
US-20110207319-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2011-08-25 US disclosed
EP-0484857-B1 Polyorganosiloxane having a quaternary salt at its one terminal and percutaneous absorption-promoting agent SAGAMI CHEM RES (JP) 1997-05-07 EP disclosed
US-5200488-A POLYORGANOSILOXANE HAVING A QUATERNARY SALT AT ITS ONE TERMINAL AND PERCUTANEOUS ABSORPTION-PROMOTING AGENT SAGAMI CHEMICAL RESEARCH CENTER (JP) 1993-04-06 US disclosed
EP-0484857-A2 Polyorganosiloxane having a quaternary salt at its one terminal and percutaneous absorption-promoting agent SAGAMI CHEMICAL RESEARCH CENTER (JP) 1992-05-13 EP disclosed