SCHEMBL2272965

SCHEMBL2272965

C[Si](C)(Cl)C1CCCC(C2CCCCCC2)CC1

nearest known ligand 0.36

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5473432 0.85 NR1H2 (0.31)
SCHEMBL197056 0.85 NR1H2 (0.31)
SCHEMBL5465892 0.85 NR1H2 (0.31)
SCHEMBL5456821 0.85 NR1H2 (0.31)
SCHEMBL1317621 0.83
SCHEMBL2274018 0.81 ALDH1A1 (0.40) ALDH1A1
SCHEMBL28260223 0.77 ALDH1A1 (0.53) ALDH1A1
SCHEMBL9516922 0.69 NR1H2 (0.31)
SCHEMBL940553 0.69 NR1H2 (0.31)
SCHEMBL202812 0.69 NR1H2 (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20130260575-A1 SILICON PRECURSORS AND COMPOSITIONS COMPRISING SAME FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS AIR PRODUCTS AND CHEMICALS, INC. (US) 2013-10-03 US claimed
WO-2011106218-A2 ULTRA LOW DIELECTRIC MATERIALS USING HYBRID PRECURSORS CONTAINING SILICON WITH ORGANIC FUNCTIONAL GROUPS BY PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION APPLIED MATERIALS, INC. (US) 2011-09-01 WO claimed
US-20110206857-A1 ULTRA LOW DIELECTRIC MATERIALS USING HYBRID PRECURSORS CONTAINING SILICON WITH ORGANIC FUNCTIONAL GROUPS BY PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION APPLIED MATERIALS, INC. (US) 2011-08-25 US claimed
US-20130260575-A1 SILICON PRECURSORS AND COMPOSITIONS COMPRISING SAME FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS AIR PRODUCTS AND CHEMICALS, INC. (US) 2013-10-03 US disclosed
US-20110206857-A1 ULTRA LOW DIELECTRIC MATERIALS USING HYBRID PRECURSORS CONTAINING SILICON WITH ORGANIC FUNCTIONAL GROUPS BY PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION APPLIED MATERIALS, INC. (US) 2011-08-25 US disclosed