⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19822562 | 0.79 | — | — | |
| SCHEMBL25167279 | 0.78 | — | — | |
| SCHEMBL2102534 | 0.77 | — | — | |
| SCHEMBL26255360 | 0.77 | — | — | |
| SCHEMBL19822561 | 0.74 | — | — | |
| SCHEMBL2272663 | 0.74 | — | — | |
| SCHEMBL17449214 | 0.74 | — | — | |
| SCHEMBL6058110 | 0.74 | ADH1B (0.36) | — | |
| SCHEMBL233791 | 0.73 | — | — | |
| SCHEMBL2274242 | 0.73 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12584212-B2 | Compositions and methods using same for germanium seed layer | VERSUM MATERIALS US, LLC (US) | 2026-03-24 | — | — | US | claimed |
| US-20230287562-A1 | COMPOSITIONS ND METHODS USING SAME FOR GERMANIUM SEED LAYER | VERSUM MATERIALS US, LLC | 2023-09-14 | — | — | US | claimed |
| CN-116113725-A | Composition for germanium seed layer and method of using the same | 弗萨姆材料美国有限责任公司 | 2023-05-12 | — | — | CN | claimed |
| EP-4176100-A1 | COMPOSITIONS AND METHODS USING SAME FOR GERMANIUM SEED LAYER | Versum Materials US, LLC (US) | 2023-05-10 | — | — | EP | claimed |
| WO-2022020705-A1 | COMPOSITIONS AND METHODS USING SAME FOR GERMANIUM SEED LAYER | VERSUM MATERIALS US, LLC (US) | 2022-01-27 | — | — | WO | claimed |
| US-12584212-B2 | Compositions and methods using same for germanium seed layer | VERSUM MATERIALS US, LLC (US) | 2026-03-24 | — | — | US | disclosed |
| US-20250188615-A1 | Gapfill Methods and Processing Assemblies | ASM IP HOLDING B.V. (NL) | 2025-06-12 | — | — | US | disclosed |
| US-12252790-B2 | Gapfill methods and processing assemblies | ASM IP HOLDING B.V. (NL) | 2025-03-18 | — | — | US | disclosed |
| US-20240117494-A1 | Gapfill methods and processing assemblies | ASM IP HOLDING B.V. (NL) | 2024-04-11 | — | — | US | disclosed |
| US-20230287562-A1 | COMPOSITIONS ND METHODS USING SAME FOR GERMANIUM SEED LAYER | VERSUM MATERIALS US, LLC | 2023-09-14 | — | — | US | disclosed |
| US-20230287562-A1 | COMPOSITIONS ND METHODS USING SAME FOR GERMANIUM SEED LAYER | VERSUM MATERIALS US, LLC | 2023-09-14 | — | — | US | disclosed |
| US-8404584-B2 | Method of manufacturing semiconductor device | FUJITSU LIMITED (JP) | 2013-03-26 | — | — | US | disclosed |
| US-20110207319-A1 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2011-08-25 | — | — | US | disclosed |