SCHEMBL2284810

SCHEMBL2284810

CO[Si]1(c2ccccc2)CCCC(C)O1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1326144 0.78
SCHEMBL2233588 0.76
Phenol SCHEMBL28189694 0.72 CA12 (0.33)
SCHEMBL2356055 0.71
SCHEMBL9064778 0.70
SCHEMBL20788769 0.68 TSHR (0.34)
SCHEMBL22632373 0.68
SCHEMBL945111 0.67 TSHR (0.33)
SCHEMBL6764296 0.67
SCHEMBL20502543 0.66 TSHR (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4703435-A1 THERMALLY CONDUCTIVE MEMBER, THERMALLY CONDUCTIVE COMPOSITION, STRUCTURE, AND METHOD FOR REWORKING STRUCTURE Sekisui Chemical Co., Ltd. (JP) 2026-03-04 EP disclosed
WO-2025105476-A1 THERMALLY CONDUCTIVE SHEET SUPPLY BODY AND METHOD FOR MANUFACTURING SAME 積水化学工業株式会社 2025-05-22 WO disclosed
WO-2025089425-A1 THERMALLY CONDUCTIVE SHEET 積水化学工業株式会社 2025-05-01 WO disclosed
WO-2024225391-A1 THERMALLY CONDUCTIVE SHEET 積水化学工業株式会社 2024-10-31 WO disclosed
WO-2024225395-A1 THERMALLY CONDUCTIVE MEMBER, THERMALLY CONDUCTIVE COMPOSITION, STRUCTURE, AND METHOD FOR REWORKING STRUCTURE 積水化学工業株式会社 2024-10-31 WO disclosed
WO-2024204755-A1 THERMALLY CONDUCTIVE SHEET AND METHOD FOR PRODUCING SAME 積水化学工業株式会社 2024-10-03 WO disclosed
WO-2024204754-A1 THERMALLY CONDUCTIVE SHEET AND MANUFACTURING METHOD THEREFOR 積水化学工業株式会社 2024-10-03 WO disclosed
WO-2024204753-A1 THERMALLY CONDUCTIVE SHEET AND METHOD FOR MANUFACTURING SAME 積水化学工業株式会社 2024-10-03 WO disclosed
CN-118715612-A Thermally conductive sheet, method of assembling the same, and method of manufacturing the same 积水保力马科技株式会社 2024-09-27 CN disclosed
CN-113906106-B Thermally conductive composition package and 2-liquid curable thermally conductive composition 积水保力马科技株式会社 2023-08-22 CN disclosed
US-20110196068-A1 RESIN COMPOSITION FOR OPTICAL LENS AND OPTICAL PACKAGING NAN YA PLASTICS CORPORATION (TW) 2011-08-11 US disclosed
US-3993839-A ORGANO-SILOXY TITANIC ACID ESTERS SHINETSU CHEMICAL COMPANY (JA) 1976-11-23 US disclosed