SCHEMBL2233588

SCHEMBL2233588

CC1CCC[Si](c2ccccc2)(c2ccccc2)O1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1326144 0.80
SCHEMBL8427881 0.79 SIGMAR1 (0.30)
SCHEMBL27507409 0.78
SCHEMBL27795485 0.77
SCHEMBL13680131 0.77
SCHEMBL28793342 0.77
SCHEMBL913096 0.76 TSHR (0.41)
SCHEMBL2284810 0.76
SCHEMBL9750709 0.75 TSHR (0.39)
SCHEMBL22555842 0.75 SLC6A2 (0.41)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3941978-A1 SILOXANE ADDITIVE MANUFACTURING COMPOSITION Spectroplast AG (CH) 2022-01-26 EP claimed
WO-2020187891-A1 SILOXANE ADDITIVE MANUFACTURING COMPOSITION SPECTROPLAST AG (CH) 2020-09-24 WO claimed
CN-119592182-A Polyether organic silicon composite material and method for preparing synthetic leather by using same 东莞市雄驰电子有限公司 2025-03-11 CN disclosed
CN-115334854-A Heat dissipation assembly, production method of heat dissipation assembly and electronic equipment 维沃移动通信有限公司 2022-11-11 CN disclosed
CN-112176443-A Preparation method of thermosensitive color-changing polyethylene fiber 湖南中泰特种装备有限责任公司 2021-01-05 CN disclosed
US-8946353-B2 Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device DOW CORNING TORAY CO. LTD. (JP) 2015-02-03 US disclosed
US-8440776-B2 Lens-forming silicone resin composition and silicone lens SHIN-ETSU CHEMICAL CO., LTD. (JP) 2013-05-14 US disclosed
US-8202933-B2 Silicone resin composition for encapsulating luminescent element and process for producing optical-semiconductor electronic part with the same through potting SANYU REC CO., LTD. (JP) 2012-06-19 US disclosed
US-8204424-B2 Cleaning blade for electrophotographic device and method for manufacturing the same BANDO CHEMICAL INDUSTRIES, LTD. (JP) 2012-06-19 US disclosed
US-20110254047-A1 Curable Organopolysiloxane Composition, Optical Semiconductor Element Sealant, And Optical Semiconductor Device DOW TORAY CO., LTD. (JP) 2011-10-20 US disclosed
EP-2352794-A1 CURABLE ORGANOPOLYSILOXANE COMPOSITION, OPTICAL SEMICONDUCTOR ELEMENT SEALANT, AND OPTICAL SEMICONDUCTOR DEVICE Dow Corning Toray Co., Ltd. (JP) 2011-08-10 EP disclosed
EP-0239961-B1 A SILICONE RUBBER COMPOSITION Shin-Etsu Chemical Co., Ltd. (JP) 1992-10-21 EP disclosed
EP-0394918-A2 Curable phosphazene compositions and coated articles IDEMITSU PETROCHEMICAL CO. LTD. (JP) 1990-10-31 EP disclosed
US-4755554-A Silicone rubber composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 1988-07-05 US disclosed
EP-0239961-A2 A silicone rubber composition Shin-Etsu Chemical Co., Ltd. (JP) 1987-10-07 EP disclosed
EP-0075381-B1 SILOXANE CROSSLINKERS DOW CORNING CORPORATION (US) 1985-04-03 EP disclosed
US-4403082-A TRIS/DIMETHOXYSILOXY/SILYLALKYL CARBOXYLATE DOW CORNING CORPORATION (US) 1983-09-06 US disclosed
EP-0075381-A1 Siloxane crosslinkers DOW CORNING CORPORATION (US) 1983-03-30 EP disclosed
US-4360687-A AN ACYLOXYALKYL-TRIS (DIMETHYLSILOXY) SILANE HAVING SILICON-BONDED HYDROGEN DOW CORNING CORPORATION (US) 1982-11-23 US disclosed
US-3974122-A Heat-curable silicone resin compositions SHIN-ETSU CHEMICAL CO., LTD. (JA) 1976-08-10 US disclosed