SCHEMBL22877648

SCHEMBL22877648

C=C(C)C(=C)CC1CCC(N(C)C)CC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4277611 0.71 ANPEP (0.43) —
SCHEMBL4277617 0.71 ANPEP (0.43) —
Hydrochloric Acid SCHEMBL2948302 0.69 ANPEP (0.42) —
Hydrochloric Acid SCHEMBL2948299 0.69 ANPEP (0.42) —
SCHEMBL1989890 0.69 ESR1 (0.34) —
SCHEMBL10325573 0.69 ESR1 (0.34) —
SCHEMBL1989889 0.69 ESR1 (0.34) —
SCHEMBL152273 0.68 TDP1 (0.32) —
SCHEMBL13067944 0.67 LMNA (0.33) —
SCHEMBL1050978 0.67 BRD4 (0.41) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3760681-A1 CONDUCTIVE WIRING MATERIAL COMPOSITION, CONDUCTIVE WIRING SUBSTRATE AND METHOD FOR PRODUCING CONDUCTIVE WIRING SUBSTRATE Shin-Etsu Chemical Co., Ltd. (JP) 2021-01-06 — — EP disclosed
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