SCHEMBL2294989

SCHEMBL2294989

O=S(=O)(F)NS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F.[LiH]

nearest known ligand 0.61

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
CA2 P00918 16/20 0.61
CA1 P00915 15/20 0.61
MMP1 P03956 6/20 0.61
MMP2 P08253 6/20 0.61
MMP9 P14780 6/20 0.61
MMP8 P22894 6/20 0.61
MMP13 P45452 6/20 0.61
F2 P00734 4/20 0.41
PRSS1 P07477 4/20 0.41
PRSS2 P07478 4/20 0.41
PRSS3 P35030 4/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2233124 0.98 CA2 (0.64) CA2CA1MMP1MMP2MMP9
SCHEMBL20094836 0.95 CA2 (0.65) CA2CA1MMP1MMP2MMP9
SCHEMBL20094834 0.95 CA2 (0.65) CA2CA1MMP1MMP2MMP9
SCHEMBL2296771 0.95 CA2 (0.61) CA2CA1MMP1MMP2MMP9
SCHEMBL2289716 0.95 CA2 (0.61) CA2CA1MMP1MMP2MMP9
SCHEMBL20094837 0.95 CA2 (0.65) CA2CA1MMP1MMP2MMP9
SCHEMBL20094835 0.95 CA2 (0.65) CA2CA1MMP1MMP2MMP9
SCHEMBL2229488 0.91 CA2 (0.54) CA2CA1MMP1MMP2MMP9
Ammonia Solution, Strong SCHEMBL29779978 0.88 CA2 (0.52) CA2CA1MMP1MMP2MMP9
SCHEMBL20476642 0.88 CA2 (0.62) CA2CA1MMP1MMP2MMP9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8936674-B2 Conductive silica sol composition, and molded article produced using the same MITSUBISHI MATERIALS CORPORATION (JP) 2015-01-20 US disclosed
US-20110210295-A1 Conductive silica sol composition, and molded article produced using the same MITSUBISHI MATERIALS CORPORATION (JP) 2011-09-01 US disclosed
EP-2354206-A1 ELECTRICALLY CONDUCTIVE SILICA SOL COMPOSITION AND MOLDED ARTICLE PRODUCED BY USING SAME Mitsubishi Materials Corporation (JP) 2011-08-10 EP disclosed