Bicarbonate

Bicarbonate

SCHEMBL2304404

C=CC1=CCCCC1.O=C(O)O

nearest known ligand 0.38

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

GSK3AGSK3BIMPA1

The experimentally established mechanism targets of Bicarbonate. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HDAC4 P56524 2/20 0.38
HDAC2 Q92769 2/20 0.38
HDAC8 Q9BY41 2/20 0.38
HDAC6 Q9UBN7 2/20 0.38
TAAR1 Q96RJ0 1/20 0.35
ACMSD Q8TDX5 1/20 0.33
PIN1 Q13526 1/20 0.33
GSTP1 P09211 1/20 0.32
CTSK P43235 1/20 0.32
HDAC3 O15379 1/20 0.31
HDAC1 Q13547 1/20 0.31
HDAC7 Q8WUI4 1/20 0.31
HDAC5 Q9UQL6 1/20 0.31
HPGD P15428 2/20 0.31
NPC1 O15118 1/20 0.31
LMNA P02545 1/20 0.31
RAB9A P51151 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
HCAR2 Q8TDS4 1/20 0.31
FFAR1 O14842 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Bicarbonate SCHEMBL14250160 1.00 HDAC4 (0.38) HDAC4HDAC2HDAC8HDAC6TAAR1
Acrylic Acid SCHEMBL29190879 0.92 LMNA (0.39) HDAC4HDAC2HDAC8HDAC6TAAR1
Benzene SCHEMBL28198980 0.89 KDM1A (0.30)
SCHEMBL27206 0.89
SCHEMBL8586607 0.89
SCHEMBL14250159 0.89 HDAC4 (0.34) HDAC4HDAC2HDAC8HDAC6TAAR1
Succinic Acid SCHEMBL3805567 0.89 FFAR1 (0.40) HDAC4HDAC2HDAC8HDAC6TAAR1
SCHEMBL868582 0.87 KDM1A (0.31) HDAC4HDAC2HDAC8HDAC6
SCHEMBL117201 0.87 KDM1A (0.31) HDAC4HDAC2HDAC8HDAC6
SCHEMBL10709752 0.87

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116217442-A Modified amine chain extender, polyurethane coating and preparation method thereof 北京东方雨虹防水技术股份有限公司 2023-06-06 CN claimed
CN-106008900-B A kind of polyurethane-polyesteramide compound and preparation method thereof 河北工业大学 2018-11-27 CN claimed
CN-106008900-A Polyurethane-polyesteramide compound and preparation method thereof 河北工业大学 2016-10-12 CN claimed
CN-117467230-A Composition and method of manufacture of articles IP传输控股公司 2024-01-30 CN disclosed
CN-116217442-A Modified amine chain extender, polyurethane coating and preparation method thereof 北京东方雨虹防水技术股份有限公司 2023-06-06 CN disclosed
CN-112745496-B Method for improving thermal stability of polycarbonate 中国石油化工股份有限公司 2023-05-16 CN disclosed
US-11236197-B2 Multi-block copolymers IP2IPO INNOVATIONS LIMITED (GB) 2022-02-01 US disclosed
CN-112745496-A Method for improving thermal stability of polycarbonate 中国石油化工股份有限公司 2021-05-04 CN disclosed
US-10293573-B2 Micro flow channel chip and method for producing flow channel chip SUMITOMO BAKELITE COMPANY LIMITED (JP) 2019-05-21 US disclosed
US-20190010277-A1 MULTI-BLOCK COPOLYMERS IMPERIAL INNOVATIONS LIMITED (GB) 2019-01-10 US disclosed
CN-106008900-B A kind of polyurethane-polyesteramide compound and preparation method thereof 河北工业大学 2018-11-27 CN disclosed
WO-2012092447-A1 POLYMER COMPOSITIONS FOR TEMPORARY BONDING PROMERUS, LLC (US) 2012-07-05 WO disclosed
US-20120172479-A1 POLYMER COMPOSITIONS FOR TEMPORARY BONDING PROMERUS LLC (US) 2012-07-05 US disclosed
US-20110318938-A1 TEMPORARY BONDING ADHESIVE FOR A SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO., LTD. (JP) 2011-12-29 US disclosed
US-20110263095-A1 TEMPORARY BONDING ADHESIVE FOR A SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO., LTD. (JP) 2011-10-27 US disclosed
EP-2351804-A1 TEMPORARILY FIXING AGENT FOR SEMICONDUCTOR WAFER, AND PROCESS FOR PRODUCTION OF SEMICONDUCTOR DEVICE USING SAME Sumitomo Bakelite Company Limited (JP) 2011-08-03 EP disclosed
EP-2351805-A1 TEMPORARILY FIXING AGENT FOR SEMICONDUCTOR WAFER, AND PROCESS FOR PRODUCTION OF SEMICONDUCTOR DEVICE USING SAME Sumitomo Bakelite Company Limited (JP) 2011-08-03 EP disclosed
EP-2264112-A2 Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same, and use of a resin composition as a temporary bonding adhesive Sumitomo Bakelite Co., Ltd. (JP) 2010-12-22 EP disclosed
EP-2264113-A2 Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same, and use of a resin composition as a temporary bonding adhesive Sumitomo Bakelite Co., Ltd. (JP) 2010-12-22 EP disclosed
WO-2009025850-A2 COPOLYMERIZATION OF EPOXIDES AND CYCLIC ANHYDRIDES CORNELL RESEARCH FOUNDATION, INC. (US) 2009-02-26 WO disclosed