Propane

Propane

SCHEMBL23045274

CCC.NC1(N)C=CC(c2ccccc2)=CC1

nearest known ligand 0.33

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MMP2 P08253 1/20 0.33
MMP3 P08254 1/20 0.33
MMP9 P14780 1/20 0.33
KDM1A O60341 8/20 0.33
MAOA P21397 8/20 0.33
MAOB P27338 8/20 0.33
HTR1A P08908 1/20 0.32
HTR2B P41595 1/20 0.32
TMEM97 Q5BJF2 1/20 0.32
SIGMAR1 Q99720 1/20 0.32
TAAR1 Q96RJ0 2/20 0.31
SLC6A2 P23975 1/20 0.31
SLC6A4 P31645 1/20 0.31
SLC6A3 Q01959 1/20 0.31
MAPT P10636 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
L3MBTL1 Q9Y468 1/20 0.31
CYP3A4 P08684 1/20 0.30
HSD17B10 Q99714 1/20 0.30
TDP1 Q9NUW8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1120013 0.93 TAAR1 (0.34) MMP3KDM1AMAOBTAAR1SLC6A2
Benzene SCHEMBL28178850 0.93 TAAR1 (0.34) MMP3KDM1AMAOBTAAR1SLC6A2
Hydrochloric Acid SCHEMBL26932148 0.91 KDM1A (0.33) KDM1AMAOAMAOBTAAR1SLC6A2
Methane SCHEMBL20572263 0.91 TAAR1 (0.33) KDM1AMAOBTAAR1SLC6A2SLC6A4
SCHEMBL7999615 0.91 TAAR1 (0.38) MMP3KDM1AMAOBTAAR1SLC6A2
Biphenyl SCHEMBL28296182 0.91 TAAR1 (0.38) MMP3KDM1AMAOBTAAR1SLC6A2
Methoxymethane SCHEMBL28729732 0.89 PDE4B (0.32) TAAR1CYP3A4HSD17B10TDP1NPC1
Dimethyl Sulfone SCHEMBL29171468 0.86 PTGS2 (0.38) HTR1ASMN1; SMN2HSD17B10
Acetone SCHEMBL28895836 0.85 MAPT (0.38) MMP2MMP9MAPTSMN1; SMN2L3MBTL1
Formamide SCHEMBL29214454 0.84 NAT1 (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114269848-B Composition for forming heat conductive material, heat conductive sheet, and device with heat conductive layer 富士胶片株式会社 2024-07-16 CN disclosed
US-20230099722-A1 COMPOSITION FOR FORMING THERMALLY CONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE SHEET, AND DEVICE WITH THERMALLY CONDUCTIVE LAYER FUJIFILM CORPORATION (JP) 2023-03-30 US disclosed
EP-4024445-A1 COMPOSITION FOR FORMING HEAT-CONDUCTING MATERIAL, HEAT-CONDUCTING MATERIAL, HEAT-CONDUCTING SHEET, AND DEVICE WITH HEAT-CONDUCTING LAYER FUJIFILM Corporation (JP) 2022-07-06 EP disclosed
WO-2021039732-A1 COMPOSITION FOR FORMING HEAT-CONDUCTING MATERIAL, HEAT-CONDUCTING MATERIAL, HEAT-CONDUCTING SHEET, AND DEVICE WITH HEAT-CONDUCTING LAYER 富士フイルム株式会社 2021-03-04 WO disclosed