Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL23071441 | 0.80 | — | — | |
| SCHEMBL23071465 | 0.79 | — | — | |
| SCHEMBL25242747 | 0.77 | — | — | |
| SCHEMBL24768312 | 0.74 | HCRTR1 (0.30) | HCRTR1HCRTR2 | |
| SCHEMBL23071437 | 0.74 | KMT2A (0.36) | — | |
| SCHEMBL25245113 | 0.73 | KCNH2 (0.34) | — | |
| SCHEMBL22205104 | 0.72 | RECQL (0.30) | — | |
| SCHEMBL23989358 | 0.71 | CASR (0.34) | — | |
| SCHEMBL24768321 | 0.71 | HCRTR1 (0.31) | HCRTR1HCRTR2 | |
| SCHEMBL21303952 | 0.71 | HCRTR1 (0.31) | HCRTR1HCRTR2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114341401-B | Surface treatment liquid for metal, concentrated liquid thereof, surface treatment liquid set for metal, surface treatment method, and method for producing printed wiring board | 四国化成工业株式会社 | 2024-04-05 | — | — | CN | disclosed |
| CN-114341401-A | Metal surface treatment liquid and concentrated liquid thereof, metal surface treatment liquid set and surface treatment method, and printed wiring board manufacturing method | 四国化成工业株式会社 | 2022-04-12 | — | — | CN | disclosed |
| WO-2021045055-A1 | METAL SURFACE TREATMENT SOLUTION AND LIQUID CONCENTRATE THEREOF, METAL SURFACE TREATMENT SOLUTION SET, METAL SURFACE TREATMENT METHOD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | 四国化成工業株式会社 | 2021-03-11 | — | — | WO | disclosed |