SCHEMBL23071441

SCHEMBL23071441

CCO[Si](CCCn1ncc(C)n1)(OCC)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23071465 0.83
SCHEMBL25242747 0.80
SCHEMBL23071503 0.80 HCRTR1 (0.31)
SCHEMBL23071437 0.78 KMT2A (0.36)
SCHEMBL25245113 0.77 KCNH2 (0.34)
SCHEMBL25252781 0.72 MAPT (0.39)
SCHEMBL22205108 0.72 ALDH1A1 (0.35)
SCHEMBL23989425 0.72 KCNH2 (0.32)
SCHEMBL23071467 0.71 DPP4 (0.35)
SCHEMBL22205144 0.70 HRH3 (0.30)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118475721-A Surface treatment liquid for metal 四国化成工业株式会社 2024-08-09 CN disclosed
CN-118414453-A Organic coating and method for producing same 四国化成工业株式会社 2024-07-30 CN disclosed
CN-114341401-B Surface treatment liquid for metal, concentrated liquid thereof, surface treatment liquid set for metal, surface treatment method, and method for producing printed wiring board 四国化成工业株式会社 2024-04-05 CN disclosed
CN-114341401-A Metal surface treatment liquid and concentrated liquid thereof, metal surface treatment liquid set and surface treatment method, and printed wiring board manufacturing method 四国化成工业株式会社 2022-04-12 CN disclosed
WO-2021045055-A1 METAL SURFACE TREATMENT SOLUTION AND LIQUID CONCENTRATE THEREOF, METAL SURFACE TREATMENT SOLUTION SET, METAL SURFACE TREATMENT METHOD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD 四国化成工業株式会社 2021-03-11 WO disclosed