SCHEMBL2307463

SCHEMBL2307463

CCO[Si](CCCc1ccc([N+](=O)[O-])cc1[N+](=O)[O-])(OCC)OCC

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 9/20 0.54
TDP1 Q9NUW8 3/20 0.54
CYP1A2 P05177 1/20 0.47
SMN1; SMN2 Q16637 3/20 0.43
MAPK1 P28482 3/20 0.43
GPR35 Q9HC97 2/20 0.43
TP53 P04637 1/20 0.43
HPGD P15428 1/20 0.43
TSHR P16473 1/20 0.43
ALOX5 P09917 1/20 0.42
MAPT P10636 7/20 0.41
KDM4E B2RXH2 2/20 0.41
KMT2A Q03164 4/20 0.40
MEN1 O00255 2/20 0.40
HIF1A Q16665 1/20 0.40
MITF O75030 1/20 0.39
TXNRD1 Q16881 1/20 0.39
TXNRD3 Q86VQ6 1/20 0.39
TXNRD2 Q9NNW7 1/20 0.39
LMNA P02545 2/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29351451 0.80 MAPT (0.63) ALDH1A1SMN1; SMN2MAPK1MAPTKDM4E
SCHEMBL303646 0.80 MAPT (0.63) ALDH1A1SMN1; SMN2MAPK1MAPTKDM4E
SCHEMBL8887647 0.79 ALDH1A1 (0.68) ALDH1A1TDP1CYP1A2SMN1; SMN2MAPK1
SCHEMBL10890268 0.79 CYP1A2 (0.64) ALDH1A1TDP1CYP1A2SMN1; SMN2MAPK1
SCHEMBL10891708 0.79 CYP1A2 (0.64) ALDH1A1TDP1CYP1A2SMN1; SMN2MAPK1
SCHEMBL11509569 0.77 ALDH1A1 (0.65) ALDH1A1TDP1CYP1A2SMN1; SMN2MAPK1
SCHEMBL395679 0.76 CYP1A2 (0.60) ALDH1A1TDP1CYP1A2SMN1; SMN2MAPK1
SCHEMBL29638033 0.76 CYP1A2 (0.64) ALDH1A1TDP1CYP1A2SMN1; SMN2MAPK1
SCHEMBL188306 0.76 CYP1A2 (0.64) ALDH1A1TDP1CYP1A2SMN1; SMN2MAPK1
SCHEMBL27961047 0.75 CYP1A2 (0.68) ALDH1A1TDP1CYP1A2SMN1; SMN2MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2349952-B1 PROCESS FOR PRODUCING A ALVEOLAR CARBON MONOLITH COMPRISING A HYERARCHICAL POROUS NETWORK UNIVERSITÉ PIERRE ET MARIE CURIE PARIS 6 (FR) 2014-12-10 EP claimed
EP-2349952-A2 METHOD FOR PREPARING A CELLULAR CARBON MONOLITH COMPRISING A HIERARCHISED POROUS NETWORK UNIVERSITE PIERRE ET MARIE CURIE (PARIS 6) (FR) 2011-08-03 EP claimed
WO-2010049650-A2 METHOD FOR PREPARING A CELLULAR CARBON MONOLITH COMPRISING A HIERARCHISED POROUS NETWORK UNIVERSITE PIERRE ET MARIE CURIE PARIS VI (FR) 2010-05-06 WO claimed
US-10759119-B2 Three dimensional mold object manufacturing apparatus, method for manufacturing three dimensional mold object, and three dimensional mold object SEIKO EPSON CORPORATION (JP) 2020-09-01 US disclosed
US-20190054704-A1 THREE DIMENSIONAL MOLD OBJECT MANUFACTURING APPARATUS, METHOD FOR MANUFACTURING THREE DIMENSIONAL MOLD OBJECT, AND THREE DIMENSIONAL MOLD OBJECT SEIKO EPSON CORPORATION (JP) 2019-02-21 US disclosed
US-10137637-B2 Three dimensional mold object manufacturing apparatus, method for manufacturing three dimensional mold object, and three dimensional mold object SEIKO EPSON CORPORATION (JP) 2018-11-27 US disclosed
US-20150239147-A1 THREE DIMENSIONAL MOLD OBJECT MANUFACTURING APPARATUS, METHOD FOR MANUFACTURING THREE DIMENSIONAL MOLD OBJECT, AND THREE DIMENSIONAL MOLD OBJECT SEIKO EPSON CORPORATION (JP) 2015-08-27 US disclosed
US-20150239175-A1 THREE DIMENSIONAL MOLD OBJECT MANUFACTURING APPARATUS, METHOD FOR MANUFACTURING THREE DIMENSIONAL MOLD OBJECT, AND THREE DIMENSIONAL MOLD OBJECT SEIKO EPSON CORPORATION (JP) 2015-08-27 US disclosed
EP-2910363-A1 THREE DIMENSIONAL MOLD OBJECT MANUFACTURING APPARATUS, METHOD FOR MANUFACTURING THREE DIMENSIONAL MOLD OBJECT, AND THREE DIMENSIONAL MOLD OBJECT Seiko Epson Corporation (JP) 2015-08-26 EP disclosed
US-20150165680-A1 THREE DIMENSIONAL MOLD OBJECT MANUFACTURING APPARATUS, METHOD FOR MANUFACTURING THREE DIMENSIONAL MOLD OBJECT, AND THREE DIMENSIONAL MOLD OBJECT SEIKO EPSON CORPORATION (JP) 2015-06-18 US disclosed
US-20150165679-A1 THREE DIMENSIONAL MOLD OBJECT MANUFACTURING APPARATUS, METHOD FOR MANUFACTURING THREE DIMENSIONAL MOLD OBJECT, AND THREE DIMENSIONAL MOLD OBJECT SEIKO EPSON CORPORATION (JP) 2015-06-18 US disclosed
US-20150158249-A1 THREE DIMENSIONAL MOLD OBJECT MANUFACTURING APPARATUS, METHOD FOR MANUFACTURING THREE DIMENSIONAL MOLD OBJECT, AND THREE DIMENSIONAL MOLD OBJECT SEIKO EPSON CORPORATION (JP) 2015-06-11 US disclosed