SCHEMBL23080092

SCHEMBL23080092

CC(=O)O/N=C(/C(=O)c1ccc2c(c1)C(CCBr)(CCBr)c1cc(-c3ccc(/C(=N\OC(C)=O)C(=O)c4ccc5c(c4)C(CCCl)(CCCl)c4ccccc4-5)c(C)c3)ccc1-2)c1ccccc1C

nearest known ligand 0.33

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
▸ PDK2 Q15119 5/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18123018 0.91 PDK2 (0.33) PDK2
SCHEMBL18123024 0.91 PDK2 (0.33) PDK2
SCHEMBL26481151 0.85 — —
SCHEMBL23285238 0.83 — —
SCHEMBL18123006 0.83 PDK2 (0.33) PDK2
SCHEMBL26443682 0.83 PDK2 (0.33) PDK2
SCHEMBL18123033 0.81 APEX1 (0.36) PDK2
SCHEMBL18123032 0.81 PDK2 (0.33) PDK2
SCHEMBL18123036 0.81 APEX1 (0.34) PDK2
SCHEMBL18374826 0.80 PDK2 (0.31) PDK2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023127402-A1 PHOTOSENSITIVE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING PATTERNED CURED FILM 東京応化工業株式会社 2023-07-06 — — WO disclosed
WO-2023127401-A1 PHOTOSENSITIVE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING PATTERNED CURED FILM 東京応化工業株式会社 2023-07-06 — — WO disclosed
WO-2023120077-A1 COMPOSITION, AND PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-06-29 — — WO disclosed
WO-2023120076-A1 PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-06-29 — — WO disclosed
WO-2023074264-A1 PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-05-04 — — WO disclosed
WO-2023058418-A1 COMPOSITION, AND PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-04-13 — — WO disclosed
WO-2023047855-A1 COMPOSITION AND PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-03-30 — — WO disclosed
WO-2023047856-A1 COMPOSITION AND PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-03-30 — — WO disclosed
WO-2022181562-A1 PHOTOCURABLE LIQUID COMPOSITION, CURED OBJECT, AND METHOD FOR PRODUCING CURED OBJECT 東京応化工業株式会社 2022-09-01 — — WO disclosed
EP-3998324-A1 WAVELENGTH CONVERSION FILM, WAVELENGTH CONVERSION FILM FORMING COMPOSITION, AND CLUSTER-CONTAINING QUANTUM DOT PRODUCTION METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2022-05-18 — — EP disclosed
WO-2021044879-A1 CURABLE COMPOSITION, FILM, OPTICAL FILM FOR LUMINESCENT DISPLAY ELEMENT, LUMINESCENT DISPLAY ELEMENT PANEL, AND LUMINESCENT DISPLAY DEVICE 学校法人慶應義塾 2021-03-11 — — WO disclosed
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