SCHEMBL23095

SCHEMBL23095

COc1cc(N)ccc1Oc1cc(Oc2ccc(N)cc2OC)cc(Oc2ccc(N)cc2OC)c1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 4/20 0.56
KDM4E B2RXH2 4/20 0.56
GAA P10253 2/20 0.56
MAPK1 P28482 3/20 0.52
HTT P42858 2/20 0.52
TSHR P16473 1/20 0.52
NR4A1 P22736 1/20 0.50
ALDH1A1 P00352 7/20 0.48
USP2 O75604 1/20 0.48
CYP19A1 P11511 2/20 0.47
LMNA P02545 1/20 0.47
CA12 O43570 1/20 0.45
CA1 P00915 1/20 0.45
CA2 P00918 1/20 0.45
CA7 P43166 1/20 0.45
CA9 Q16790 1/20 0.45
CA14 Q9ULX7 1/20 0.45
SMN1; SMN2 Q16637 1/20 0.44
MEN1 O00255 1/20 0.44
THRB P10828 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29764086 1.00 MAPT (0.56) MAPTKDM4EGAAMAPK1HTT
SCHEMBL29764004 0.96 MAPT (0.58) MAPTKDM4EGAAMAPK1HTT
SCHEMBL310789 0.96 MAPT (0.58) MAPTKDM4EGAAMAPK1HTT
SCHEMBL31457261 0.90 MAPT (0.55) MAPTKDM4EGAAMAPK1HTT
SCHEMBL11401708 0.88 MAPK1 (0.56) MAPTKDM4EGAAMAPK1HTT
SCHEMBL3811355 0.86 TTR (0.58) MAPTKDM4EGAAMAPK1HTT
SCHEMBL30222339 0.86 TTR (0.58) MAPTKDM4EGAAMAPK1HTT
Hydrochloric Acid SCHEMBL5548964 0.85 TTR (0.57) MAPTKDM4EGAAMAPK1HTT
SCHEMBL2438047 0.84 KDM4E (0.67) MAPTKDM4EGAAMAPK1HTT
SCHEMBL77823 0.84 KDM4E (0.67) MAPTKDM4EGAAMAPK1HTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230027931-A1 THERMOPLASTIC MOULDING COMPOSITION CONTAINING POLYALKYLENE TEREPHTHALATE BASF SE (DE) 2023-01-26 US disclosed
US-20180006303-A1 ELECTROLYTE MATERIALS FOR USE IN ELECTROCHEMICAL CELLS SION POWER CORPORATION (US) 2018-01-04 US disclosed
EP-2714806-B1 THERMOPLASTIC MOULDING MATERIAL BASF SE (DE) 2015-07-08 EP disclosed
US-8987357-B2 Thermoplastic molding composition BASF SE (DE) 2015-03-24 US disclosed
US-20140045070-A1 ELECTROCHEMICAL CELLS COMPRISING POLYIMIDES BASF SE (DE) 2014-02-13 US disclosed
EP-2609646-A1 ELECTROLYTE MATERIALS FOR USE IN ELECTROCHEMICAL CELLS BASF SE (DE) 2013-07-03 EP disclosed
US-20120302677-A1 THERMOPLASTIC MOLDING COMPOSITION BASF SE (DE) 2012-11-29 US disclosed
WO-2012025543-A1 ELECTROLYTE MATERIALS FOR USE IN ELECTROCHEMICAL CELLS BASF SE (DE) 2012-03-01 WO disclosed
US-8093349-B2 Terminally modified polybranched polyimide, metal-plated terminally modified polybranched polyimide, and method for producing the same UBE INDUSTRIES, LTD. (JP) 2012-01-10 US disclosed
US-20100009206-A1 TERMINALLY MODIFIED POLYBRANCHED POLYIMIDE, METAL-PLATED TERMINALLY MODIFIED POLYBRANCHED POLYIMIDE, AND METHOD FOR PRODUCING THE SAME UBE INDUSTRIES, LTD. (JP) 2010-01-14 US disclosed