SCHEMBL2311533

SCHEMBL2311533

NCCCOCCCCCCOCCCN

nearest known ligand 0.86

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ODC1 P11926 1/20 0.50
DNM1 Q05193 4/20 0.47
CA12 O43570 2/20 0.47
CA1 P00915 2/20 0.47
CA2 P00918 2/20 0.47
CA3 P07451 2/20 0.47
CA4 P22748 2/20 0.47
CA6 P23280 2/20 0.47
CA5A P35218 2/20 0.47
CA7 P43166 2/20 0.47
CA9 Q16790 2/20 0.47
CA14 Q9ULX7 2/20 0.47
CA5B Q9Y2D0 2/20 0.47
TSHR P16473 2/20 0.47
LMNA P02545 1/20 0.47
BLM P54132 1/20 0.47
NFKB1 P19838 1/20 0.40
CYP3A4 P08684 1/20 0.38
MEN1 O00255 2/20 0.36
KMT2A Q03164 2/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ethylenediamine SCHEMBL10792600 1.00 ODC1 (0.50) ODC1DNM1CA12CA1CA2
SCHEMBL1344404 1.00 ODC1 (0.50) ODC1DNM1CA12CA1CA2
SCHEMBL816340 1.00 ODC1 (0.50) ODC1DNM1CA12CA1CA2
SCHEMBL2408770 1.00 ODC1 (0.50) ODC1DNM1CA12CA1CA2
SCHEMBL8658323 0.97 DNM1 (0.53) ODC1DNM1CA12CA1CA2
SCHEMBL1733699 0.97 DNM1 (0.53) ODC1DNM1CA12CA1CA2
SCHEMBL7112669 0.97 DNM1 (0.53) ODC1DNM1CA12CA1CA2
SCHEMBL7111736 0.97 DNM1 (0.53) ODC1DNM1CA12CA1CA2
SCHEMBL6010209 0.97 DNM1 (0.53) ODC1DNM1CA12CA1CA2
SCHEMBL11284295 0.97 DNM1 (0.53) ODC1DNM1CA12CA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 210 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024245872-A1 POLYAMIDE COMPOSITION FOR BOREHOLE TOOL EMS-CHEMIE AG (CH) 2024-12-05 WO claimed
CN-113631624-B Curing agent composition for epoxy resin compounds, epoxy resin compounds with improved low temperature curing and multicomponent epoxy resin systems 喜利得股份公司 2023-10-20 CN claimed
US-20220213259-A1 Curing agent composition for an epoxy resin compound, epoxy resin compound and multi-component epoxy resin system with improved low-temperature curing HILTI AKTIENGESELLSCHAFT (LI) 2022-07-07 US claimed
EP-3962984-A1 CURING COMPOSITION FOR AN EPOXY RESIN COMPOSITION, EPOXY RESIN COMPOSITION, AND MULTI-COMPONENT EPOXY RESIN SYSTEM WITH IMPROVED LOW TEMPERATURE CURING Hilti Aktiengesellschaft (LI) 2022-03-09 EP claimed
CN-113631624-A Curing agent composition for epoxy resin compounds, epoxy resin compounds with improved low temperature cure, and multi-component epoxy resin systems 喜利得股份公司 2021-11-09 CN claimed
EP-3733731-A1 CURING AGENT COMPOSITION FOR AN EPOXY RESIN COMPOSITION, EPOXY RESIN COMPOSITION AND MULTI-COMPONENT EPOXY RESIN SYSTEM WITH IMPROVED LOW TEMPERATURE CURING Hilti Aktiengesellschaft (LI) 2020-11-04 EP claimed
US-9631070-B2 Filler materials having surface coating made from water soluble polyamides EMS-PATENT AG (CH) 2017-04-25 US claimed
EP-2994508-B1 FILLERS WITH A SURFACE COATING OF WATER-SOLUBLE POLYAMIDES EMS PATENT AG (CH) 2017-01-04 EP claimed
US-20160060436-A1 FILLER MATERIALS HAVING SURFACE COATING MADE FROM WATER SOLUBLE POLYAMIDES EMS-PATENT AG (CH) 2016-03-03 US claimed
EP-0485396-B1 COPOLYMER OF DODECANE TEREPHTHALAMIDE ALLIED SIGNAL INC (US) 1995-08-02 EP claimed
EP-0620832-A1 PREPARATION OF DODECANE TEREPHTHALAMIDE POLYMERS AlliedSignal Inc. (US) 1994-10-26 EP claimed
WO-1993014145-A1 PREPARATION OF DODECANE TEREPHTHALAMIDE POLYMERS ALLIED-SIGNAL INC. (US) 1993-07-22 WO claimed
US-5191060-A Melting point, dimensional stability ALLIED SIGNAL 1993-03-02 US claimed
EP-0485396-A1 COPOLYMER OF DODECANE TEREPHTHALAMIDE. ALLIED SIGNAL INC (US) 1992-05-20 EP claimed
US-5079339-A Polyamides with reduced water absorption ALLIED-SIGNAL INC. (US) 1992-01-07 US claimed
WO-1991002017-A1 COPOLYMER OF DODECANE TEREPHTHALAMIDE ALLIED-SIGNAL INC. (US) 1991-02-21 WO claimed
EP-0164538-B1 PROCESS FOR PREPARING ANTI-SLIP LACQUERS SCHERING AKTIENGESELLSCHAFT (DE) 1987-08-26 EP claimed
US-4655836-A A POLYAMIDE FROM A POLYMERIZED FATTY ACID AND A DIPRIMARY ETHER-CONTAINING DIAMINE; PLASTIC PACKAGING SCHERING AKTIENGESELLSCHAFT (DE) 1987-04-07 US claimed
EP-4739727-A1 CURING AGENT COMPOSITION COMPRISING SALTS OF THIOCYANATE Hilti Aktiengesellschaft (LI) 2026-05-13 EP disclosed
US-3933737-A SULFUR-CONTAINING ORGANOTIN COMPOUNDS AND NON-SULFUR-CONTAINING ORGANOTIN COMPOUNDS KABEL-UND METALLWERKE GUTEHOFFNUNGSHUTTE AKTIENGESELLSCHAFT (DT) 1976-01-20 US disclosed