⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2314888 | 0.93 | — | — | |
| SCHEMBL2309926 | 0.90 | — | — | |
| SCHEMBL2315400 | 0.90 | — | — | |
| SCHEMBL11188049 | 0.89 | SPHK1 (0.31) | — | |
| SCHEMBL27586420 | 0.66 | CYP19A1 (0.36) | — | |
| SCHEMBL649223 | 0.65 | SPHK1 (0.41) | — | |
| SCHEMBL28210087 | 0.64 | — | — | |
| SCHEMBL565199 | 0.60 | ALDH1A1 (0.36) | — | |
| SCHEMBL25167928 | 0.59 | — | — | |
| SCHEMBL4778430 | 0.59 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20110263095-A1 | TEMPORARY BONDING ADHESIVE FOR A SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME | SUMITOMO BAKELITE CO., LTD. (JP) | 2011-10-27 | — | — | US | disclosed |
| EP-2351805-A1 | TEMPORARILY FIXING AGENT FOR SEMICONDUCTOR WAFER, AND PROCESS FOR PRODUCTION OF SEMICONDUCTOR DEVICE USING SAME | Sumitomo Bakelite Company Limited (JP) | 2011-08-03 | — | — | EP | disclosed |
| EP-2264113-A2 | Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same, and use of a resin composition as a temporary bonding adhesive | Sumitomo Bakelite Co., Ltd. (JP) | 2010-12-22 | — | — | EP | disclosed |