SCHEMBL232569

SCHEMBL232569

CC(O)OC(C)OC(C)N(C)C

nearest known ligand 0.30

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.30
TSHR P16473 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL35891 0.86
SCHEMBL3973875 0.86
SCHEMBL6694567 0.80 ALDH1A1 (0.39) ALDH1A1TSHR
SCHEMBL6700781 0.76 ALDH1A1 (0.36) ALDH1A1TSHR
SCHEMBL5442841 0.75
SCHEMBL9702141 0.73 ALDH1A1 (0.32) ALDH1A1TSHR
SCHEMBL15161 0.73
SCHEMBL1408731 0.72 ALDH1A1 (0.36) ALDH1A1TSHR
SCHEMBL5709950 0.71 ALDH1A1 (0.31) ALDH1A1
Hydrochloric Acid SCHEMBL473386 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 120 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0489553-B1 Photosensitive polymeric printing medium and water developable printing plates NAPP SYSTEMS INC (US) 1997-05-28 EP claimed
EP-3959217-B1 IMPROVEMENTS IN OR RELATING TO CURATIVES HEXCEL COMPOSITES LTD (GB) 2025-10-15 EP disclosed
EP-4585594-A1 GLYCIDYL GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED PRODUCT AND MULTILAYER BODY DIC Corporation (JP) 2025-07-16 EP disclosed
WO-2025105121-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND DISASSEMBLABLE ADHESIVE MATERIAL DIC株式会社 2025-05-22 WO disclosed
WO-2025105118-A1 EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND DISASSEMBLING METHOD DIC株式会社 2025-05-22 WO disclosed
WO-2025105119-A1 EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND DISASSEMBLING METHOD DIC株式会社 2025-05-22 WO disclosed
US-20250122411-A1 EPOXY RESIN COMPOSITION, AND CURED PRODUCT AND LAMINATE THEREOF DIC CORPORATION (JP) 2025-04-17 US disclosed
WO-2025033160-A1 AMINO GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE DIC株式会社 2025-02-13 WO disclosed
WO-2025033157-A1 AMINO GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED ARTICLE, AND LAMINATE DIC株式会社 2025-02-13 WO disclosed
WO-2025033159-A1 AMINO GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE DIC株式会社 2025-02-13 WO disclosed
US-6727325-B1 HEAT RESISTANCE, STABILITY, POT LIFE; ONE-PACK MIXTURES; LOW TEMPERATURE CURABILITY NIPPON SODA CO. LTD. (JP) 2004-04-27 US disclosed
US-6653362-B2 Using as polyol component specified polyethers made using different catalysts including zinc hexacyanocobaltate and an alkali metal hydroxide, and an addition-condensation co-polyether; vibration absorption, low resilience: auto seat ASAHI GLASS COMPANY, LIMITED (JP) 2003-11-25 US disclosed
US-20030114550-A1 Flexible polyurethane foam, its production method and material system for its production ASAHI GLASS COMPANY LIMITED (JP) 2003-06-19 US disclosed
US-20030045595-A1 Process for producing flexible polyurethane foam ASAHI GLASS COMPANY LIMITED (JP) 2003-03-06 US disclosed
EP-1283231-A1 Flexible polyurethane foam, its production method and material system for its production ASAHI GLASS COMPANY LTD. (JP) 2003-02-12 EP disclosed
EP-1273605-A1 PROCESS FOR PRODUCING FLEXIBLE POLYURETHANE FOAM ASAHI GLASS COMPANY LTD. (JP) 2003-01-08 EP disclosed
US-6306918-B1 FOGGING TEST BY MIXING POLYOL, WATER AMD AMINE CATALYST FOR REACTION OF POLYISOCYANATE AND ALCOHOL KAO CORPORATION (JP) 2001-10-23 US disclosed
US-6045741-A POLYOL CONTAINING A HYDROPHILIC ORGANIC ACID METAL SALT AND/OR A POLYMER THEREOF IS USED AS THE POLYOL. THE POLYURETHANE FOAM IS THE POLYURETHANE FOAM IS COMPRESSED TO A THICKNESS OF 5 TO 80% OF ITS INITIAL THICKNESS. BRIDGESTONE CORPORATION (JP) 2000-04-04 US disclosed
EP-0949286-A1 CURATIVES FOR EPOXY RESIN, CURING ACCELERATOR, AND EPOXY RESIN COMPOSITION NIPPON SODA CO., LTD. (JP) 1999-10-13 EP disclosed
WO-1988002135-A1 WATER-DEVELOPABLE PHOTOSENSITIVE PLATE AND ITS PRODUCTION NAPP SYSTEMS (USA), INC. (US) 1988-03-24 WO disclosed