SCHEMBL2335486

SCHEMBL2335486

O=C(CCCCCO)NCCNC(=O)CCCCCO

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 1/20 0.52
FAAH O00519 4/20 0.50
DNM1 Q05193 2/20 0.50
GPR84 Q9NQS5 1/20 0.50
FFAR1 O14842 1/20 0.50
FFAR4 Q5NUL3 1/20 0.50
SELP P16109 1/20 0.49
GAA P10253 1/20 0.48
FNTA P49354 1/20 0.48
FNTB P49356 1/20 0.48
CNR1 P21554 3/20 0.47
ALDH1A1 P00352 2/20 0.47
HPGD P15428 2/20 0.47
TRPV1 Q8NER1 1/20 0.47
MEN1 O00255 1/20 0.47
MAPT P10636 1/20 0.47
ALOX12 P18054 1/20 0.47
BLM P54132 1/20 0.47
KMT2A Q03164 1/20 0.47
TDP1 Q9NUW8 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15006877 1.00 NAAA (0.52) NAAAFAAHDNM1GPR84FFAR1
SCHEMBL8407596 1.00 NAAA (0.52) NAAAFAAHDNM1GPR84FFAR1
SCHEMBL15006920 1.00 NAAA (0.52) NAAAFAAHDNM1GPR84FFAR1
SCHEMBL15007030 1.00 NAAA (0.52) NAAAFAAHDNM1GPR84FFAR1
SCHEMBL25447807 0.93 NAAA (0.61) NAAAFAAHDNM1GPR84FFAR1
SCHEMBL13402876 0.93 NAAA (0.61) NAAAFAAHDNM1GPR84FFAR1
SCHEMBL14984045 0.93 NAAA (0.61) NAAAFAAHDNM1GPR84FFAR1
SCHEMBL15006922 0.93 NAAA (0.61) NAAAFAAHDNM1GPR84FFAR1
SCHEMBL11779596 0.93 SELP (0.56) NAAAFAAHDNM1GPR84FFAR1
SCHEMBL3832619 0.93 SELP (0.56) NAAAFAAHDNM1GPR84FFAR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3237179-B1 METHOD OF ADDITIVE MANUFACTURING USING MOLECULARY SELF-ASSEMBLING MATERIALS AND MICROFILLERS DOW GLOBAL TECHNOLOGIES LLC (US) 2020-02-19 EP disclosed
EP-2533654-B1 SELF ASSEMBLING POLYMER MEMBRANES IN FOOD PACKAGING APPLICATION DOW GLOBAL TECHNOLOGIES LLC (US) 2019-10-09 EP disclosed
US-20170369674-A1 METHOD OF ADDITIVE MANUFACTURING USING MOLECULARLY SELF-ASSEMBLING MATERIALS AND MICROFILLERS DOW GLOBAL TECHNOLOGIES LLC (US) 2017-12-28 US disclosed
EP-3237179-A1 METHOD OF ADDITIVE MANUFACTURING USING MOLECULARY SELF-ASSEMBLING MATERIALS AND MICROFILLERS Dow Global Technologies LLC (US) 2017-11-01 EP disclosed
WO-2016105945-A1 METHOD OF ADDITIVE MANUFACTURING USING MOLECULARY SELF-ASSEMBLING MATERIALS AND MICROFILLERS DOW GLOBAL TECHNOLOGIES LLC (US) 2016-06-30 WO disclosed
US-9193487-B2 Self assembling polymer membranes in food packaging application DOW GLOBAL TECHNOLOGIES, LLC 2015-11-24 US disclosed
US-9150763-B2 Adhesive polymers for forming laminate structures DOW GLOBAL TECHNOLOGIES LLC 2015-10-06 US disclosed
EP-2814877-A1 NUCLEATING AGENTS FOR BIOPOLYMERS Technische Universiteit Eindhoven (NL) 2014-12-24 EP disclosed
US-8584871-B2 High-output solvent-based electrospinning DOW GLOBAL TECHNOLOGIES LLC 2013-11-19 US disclosed
WO-2013120793-A1 NUCLEATING AGENTS FOR BIOPOLYMERS TECHNISCHE UNIVERSITEIT EINDHOVEN (NL) 2013-08-22 WO disclosed
EP-2111486-A2 POLYMER OR OLIGOMER FIBERS BY SOLVENT-FREE ELECTROSPINNING Dow Global Technologies Inc. (US) 2009-10-28 EP disclosed
WO-2008150970-A2 HIGH-OUTPUT SOLVENT-BASED ELECTROSPINNING DOW GLOBAL TECHNOLOGIES INC. (US) 2008-12-11 WO disclosed
US-20080241528-A1 Polyester-Amide Based Hot Melt Adhesives DOW GLOBAL TECHNOLOGIES LLC 2008-10-02 US disclosed
WO-2008112834-A1 ADHESIVE POLYMERS FOR FORMING LAMINATE STRUCTURES DOW GLOBAL TECHNOLOGIES INC. (US) 2008-09-18 WO disclosed
US-20080214743-A1 Aliphatic Polyester-Amide Compositions and a Process for Producing the Same DOW GLOBAL TECHNOLOGIES LLC 2008-09-04 US disclosed
WO-2008101051-A2 POLYMER OR OLIGOMER FIBERS BY SOLVENT-FREE ELECTROSPINNING DOW GLOBAL TECHNOLOGIES INC. (US) 2008-08-21 WO disclosed
EP-1928969-A1 POLYESTER-AMIDE BASED HOT MELT ADHESIVES DOW GLOBAL TECHNOLOGIES INC. (US) 2008-06-11 EP disclosed
EP-1910444-A2 ALIPHATIC POLYESTER-AMIDE COMPOSITIONS AND A PROCESS FOR PRODUCING THE SAME The Dow Global Technologies Inc. (US) 2008-04-16 EP disclosed
WO-2007099397-A2 ALIPHATIC POLYESTER-AMIDE COMPOSITIONS AND A PROCESS FOR PRODUCING THE SAME DOW GLOBAL TECHNOLOGIES INC. (US) 2007-09-07 WO disclosed
WO-2007030791-A1 POLYESTER-AMIDE BASED HOT MELT ADHESIVES DOW GLOBAL TECHNOLOGIES INC. (US) 2007-03-15 WO disclosed