SCHEMBL2337812

SCHEMBL2337812

CCO[SiH](OCC)OCC.O=C1C=CO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5199129 0.83
Benzyl Alcohol SCHEMBL28607632 0.82 TSHR (0.42)
Ether SCHEMBL1638308 0.78
SCHEMBL28627132 0.75 NQO1 (0.33)
SCHEMBL1936436 0.74
Furan-2(5H)-One SCHEMBL1468144 0.74 CA1 (0.59)
SCHEMBL2992488 0.73 CA1 (0.33)
SCHEMBL28928064 0.73
SCHEMBL3689229 0.73 GSK3A (0.50)
SCHEMBL35885 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118318191-A Composition for forming wavelength conversion film 日产化学株式会社 2024-07-09 CN disclosed
CN-118192168-A Photosensitive resin composition 日产化学株式会社 2024-06-14 CN disclosed
WO-2024122572-A1 WAVELENGTH CONVERSION FILM-FORMING COMPOSITION AND FUSED THIOPHENE COMPOUND 日産化学株式会社 2024-06-13 WO disclosed
CN-110537146-B Photosensitive resin composition 日产化学株式会社 2024-03-15 CN disclosed
CN-110537147-B Photosensitive resin composition 日产化学株式会社 2024-03-12 CN disclosed
WO-2024024502-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION 日産化学株式会社 2024-02-01 WO disclosed
CN-110573963-B Photosensitive resin composition 日产化学株式会社 2023-10-24 CN disclosed
CN-116848466-A Positive photosensitive resin composition 日产化学株式会社 2023-10-03 CN disclosed
WO-2023140170-A1 RING-FUSED THIOPHENE COMPOUND, AND COMPOSITION FOR WAVELENGTH CONVERSION FILM FORMATION USE WHICH CONTAINS SAME 国立大学法人東海国立大学機構 2023-07-27 WO disclosed
WO-2023100809-A1 WAVELENGTH CONVERSION FILM FORMING COMPOSITION 日産化学株式会社 2023-06-08 WO disclosed
CN-104737075-A Photocurable composition 3M INNOVATIVE PROPERTIES CO 2015-06-24 CN disclosed
US-8969475-B2 Method for preparing a modified ethylene-vinyl alcohol copolymer THE YOKOHAMA RUBBER CO., LTD. (JP) 2015-03-03 US disclosed
US-20140334066-A1 SOLID ELECTROLYTE CAPACITOR AND A METHOD FOR MANUFACTURING THE SAME TAYCA CORPORATION (JP) 2014-11-13 US disclosed
US-20140211374-A1 DISPERSION OF ELECTRICALLY CONDUCTIVE POLYMER, AND ELECTRICALLY CONDUCTIVE POLYMER AND USE THEREOF TAYCA CORPORATION (JP) 2014-07-31 US disclosed
US-20130123428-A1 Method for Preparing a Modified Ethylene-Vinyl Alcohol Copolymer The Yokohama Rubber Col, Ltd. (JP) 2013-05-16 US disclosed
EP-2159234-B1 Modified ethylene-vinyl alcohol copolymer, gas barrier resin, and molded article of the same YOKOHAMA RUBBER CO LTD (JP) 2011-08-24 EP disclosed
CN-1738711-B Silica-containing layered structure and coating composition for forming porous silica layer ASAHI KASEI FIBERS CORP 2010-06-23 CN disclosed
EP-2159234-A1 Modified ethylene-vinyl alcohol copolymer, gas barrier resin, and molded article of the same THE YOKOHAMA RUBBER CO., LTD. (JP) 2010-03-03 EP disclosed
US-20100047586-A1 MODIFIED ETHYLENE-VINYL ALCOHOL COPOLYMER, GAS BARRIER RESIN, AND MOLDED ARTICLE OF THE SAME THE YOKOHAMA RUBBER CO., LTD. (JP) 2010-02-25 US disclosed
CN-1738711-A Silica-containing layered structure and coating composition for forming porous silica layer ASAHI CHEMICAL IND (JP) 2006-02-22 CN disclosed