SCHEMBL2346199

SCHEMBL2346199

CCCCCCCc1cc(O)c(CCCCCCC)cc1O

nearest known ligand 0.68

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALOX5 P09917 4/20 0.68
TYR P14679 3/20 0.68
CYP3A4 P08684 2/20 0.68
MEN1 O00255 1/20 0.68
TP53 P04637 1/20 0.68
MAPT P10636 1/20 0.68
ALOX15 P16050 1/20 0.68
TSHR P16473 1/20 0.68
HTT P42858 1/20 0.68
KMT2A Q03164 1/20 0.68
TDP1 Q9NUW8 1/20 0.68
PTGS2 P35354 6/20 0.54
BID P55957 3/20 0.49
MCL1 Q07820 3/20 0.49
BCL2L1 Q07817 2/20 0.49
BAK1 Q16611 2/20 0.49
KAT8 Q9H7Z6 2/20 0.49
PPARG P37231 1/20 0.49
PPARA Q07869 1/20 0.49
EP300 Q09472 1/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2348704 1.00 ALOX5 (0.68) ALOX5TYRCYP3A4MEN1TP53
SCHEMBL325823 1.00 ALOX5 (0.68) ALOX5TYRCYP3A4MEN1TP53
SCHEMBL8589296 1.00 ALOX5 (0.68) ALOX5TYRCYP3A4MEN1TP53
SCHEMBL2344847 1.00 ALOX5 (0.68) ALOX5TYRCYP3A4MEN1TP53
SCHEMBL2348444 1.00 ALOX5 (0.68) ALOX5TYRCYP3A4MEN1TP53
SCHEMBL8942889 1.00 ALOX5 (0.68) ALOX5TYRCYP3A4MEN1TP53
SCHEMBL7516859 1.00 ALOX5 (0.68) ALOX5TYRCYP3A4MEN1TP53
SCHEMBL4879945 1.00 ALOX5 (0.68) ALOX5TYRCYP3A4MEN1TP53
SCHEMBL143956 0.98 ALOX5 (0.64) ALOX5TYRCYP3A4MEN1TP53
SCHEMBL11321268 0.96 ALOX5 (0.63) ALOX5TYRCYP3A4MEN1TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8008410-B2 Epoxy resin composition for encapsulating semiconductor and semiconductor device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-08-30 US disclosed
US-20080128922-A1 Epoxy resin composition for encapsulating semiconductor and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2008-06-05 US disclosed