Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 2/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.35 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.34 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.32 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.31 |
| ▸ | MEN1 | O00255 | 1/20 | 0.31 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1981888 | 0.86 | TSHR (0.46) | TSHRALDH1A1SMN1; SMN2TDP1MEN1 | |
| SCHEMBL17135244 | 0.77 | — | — | |
| SCHEMBL822973 | 0.76 | ALDH1A1 (0.42) | TSHRALDH1A1SMN1; SMN2TDP1 | |
| SCHEMBL17135246 | 0.74 | LPAR3 (0.32) | TSHR | |
| SCHEMBL29142460 | 0.74 | TSHR (0.43) | TSHRALDH1A1SMN1; SMN2TDP1MAPK1 | |
| SCHEMBL27507020 | 0.73 | ALDH1A1 (0.40) | ALDH1A1SMN1; SMN2TDP1 | |
| SCHEMBL2512480 | 0.73 | ALDH1A1 (0.32) | ALDH1A1TDP1 | |
| SCHEMBL29223404 | 0.71 | ALDH1A1 (0.43) | TSHRALDH1A1TDP1 | |
| Water SCHEMBL5178814 | 0.71 | ALDH1A1 (0.39) | ALDH1A1SMN1; SMN2TDP1 | |
| SCHEMBL15129980 | 0.71 | ALDH1A1 (0.56) | TSHRALDH1A1SMN1; SMN2TDP1MAPK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2477215-A2 | Resin composition, embedding material, insulating layer and semiconductor device | Sumitomo Bakelite Company Limited (JP) | 2012-07-18 | — | — | EP | disclosed |
| US-7999354-B2 | Resin composition, filling material, insulating layer and semiconductor device | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2011-08-16 | — | — | US | disclosed |
| US-20100181684-A1 | RESIN COMPOSITION, FILLING MATERIAL, INSULATING LAYER AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2010-07-22 | — | — | US | disclosed |
| EP-2166036-A1 | RESIN COMPOSITION, EMBEDDING MATERIAL, INSULATING LAYER, AND SEMICONDUCTOR DEVICE | Sumitomo Bakelite Company Limited (JP) | 2010-03-24 | — | — | EP | disclosed |
| US-5650234-A | FOR USE AS MEMBRANE COATINGS | SURFACE ENGINEERING TECHNOLOGIES, DIVISION OF INNERDYNE, INC. (US) | 1997-07-22 | — | — | US | disclosed |