Known targets — ChEMBL curated mechanism
ACHEADRA1AADRA1BADRA1DADRA2AADRA2BADRA2CADRB1ADRB2ADRB3APH1AAPH1BCHRM2CHRM3EZH2GRIN2AHTR1AHTR1BHTR1DHTR1FHTR3ANCSTNP2RY12PSEN1PSEN2PSENENSIGMAR1SLC6A2SLC6A3SLC6A4
The experimentally established mechanism targets of Bromide. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TRIM24 | O15164 | 1/20 | 0.54 |
| ▸ | TRIM33 | Q9UPN9 | 1/20 | 0.54 |
| ▸ | TRPA1 | O75762 | 1/20 | 0.48 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.48 |
| ▸ | CA2 | P00918 | 8/20 | 0.46 |
| ▸ | CA12 | O43570 | 7/20 | 0.46 |
| ▸ | CA9 | Q16790 | 5/20 | 0.46 |
| ▸ | NFKB1 | P19838 | 3/20 | 0.46 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.46 |
| ▸ | CDK4 | P11802 | 1/20 | 0.46 |
| ▸ | CCND1 | P24385 | 1/20 | 0.46 |
| ▸ | SIRT2 | Q8IXJ6 | 1/20 | 0.46 |
| ▸ | JUN | P05412 | 1/20 | 0.46 |
| ▸ | NFE2L2 | Q16236 | 1/20 | 0.46 |
| ▸ | MAPT | P10636 | 3/20 | 0.45 |
| ▸ | CA4 | P22748 | 2/20 | 0.45 |
| ▸ | LMNA | P02545 | 2/20 | 0.45 |
| ▸ | HPGD | P15428 | 2/20 | 0.45 |
| ▸ | NPC1 | O15118 | 1/20 | 0.45 |
| ▸ | GMNN | O75496 | 1/20 | 0.45 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29511549 | 0.97 | — | — | |
| SCHEMBL20076 | 0.97 | — | — | |
| Fluoride SCHEMBL2197395 | 0.95 | TRIM24 (0.54) | TRIM24TRIM33TRPA1ALDH1A1CA2 | |
| SCHEMBL27854641 | 0.95 | TRIM24 (0.54) | TRIM24TRIM33TRPA1ALDH1A1CA2 | |
| SCHEMBL28147333 | 0.95 | TRIM24 (0.54) | TRIM24TRIM33TRPA1ALDH1A1CA2 | |
| Benzene SCHEMBL23581564 | 0.95 | TRIM24 (0.54) | TRIM24TRIM33TRPA1ALDH1A1CA2 | |
| Methane SCHEMBL2951846 | 0.95 | TRIM24 (0.54) | TRIM24TRIM33TRPA1ALDH1A1CA2 | |
| SCHEMBL6122881 | 0.95 | TRIM24 (0.54) | TRIM24TRIM33TRPA1ALDH1A1CA2 | |
| Water SCHEMBL27841262 | 0.95 | TRIM24 (0.54) | TRIM24TRIM33TRPA1ALDH1A1CA2 | |
| SCHEMBL27862002 | 0.95 | TRIM24 (0.54) | TRIM24TRIM33TRPA1ALDH1A1CA2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 127 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024116572-A1 | IMIDE GROUP-CONTAINING RESIN | 東洋紡エムシー株式会社 | 2024-06-06 | — | — | WO | disclosed |
| WO-2024116571-A1 | ADHESIVE COMPOSITION | 東洋紡エムシー株式会社 | 2024-06-06 | — | — | WO | disclosed |
| WO-2024090394-A1 | LAMINATED STRUCTURE, METHOD FOR PRODUCING SAME, CURED PRODUCT, AND ELECTRONIC COMPONENT | 太陽ホールディングス株式会社 | 2024-05-02 | — | — | WO | disclosed |
| WO-2024090396-A1 | CURABLE RESIN COMPOSITION, MULTILAYER STRUCTURE, CURED PRODUCT AND ELECTRONIC COMPONENT | 太陽ホールディングス株式会社 | 2024-05-02 | — | — | WO | disclosed |
| WO-2023031986-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTILAYER PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD | 昭和電工マテリアルズ株式会社 | 2023-03-09 | — | — | WO | disclosed |
| CN-112313302-B | Adhesive composition comprising acrylonitrile butadiene rubber co-polyamideimide resin | 东洋纺株式会社 | 2022-06-03 | — | — | CN | disclosed |
| CN-109843981-B | Polycarbonate imide resin and resin composition containing the same | 东洋纺株式会社 | 2022-05-31 | — | — | CN | disclosed |
| CN-106715590-B | Polycarbonate imide resin paste and electronic component having solder resist layer, surface protective layer, interlayer insulating layer or adhesive layer obtained by curing the paste | 东洋纺株式会社 | 2022-01-04 | — | — | CN | disclosed |
| WO-2021060285-A1 | CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT | 太陽インキ製造株式会社 | 2021-04-01 | — | — | WO | disclosed |
| CN-112534019-A | Adhesive composition using resin having imide bond and phosphorus compound | 东洋纺株式会社 | 2021-03-19 | — | — | CN | disclosed |
| EP-0919873-B1 | Photo curable resin composition and photosensitive element | HITACHI CHEMICAL CO LTD (JP) | 2004-01-21 | — | — | EP | disclosed |
| EP-0915383-B1 | Photosensitive resin composition | HITACHI CHEMICAL CO LTD (JP) | 2004-01-21 | — | — | EP | disclosed |
| US-6583198-B2 | A photocurable resin consists of an acid modified vinyl group containing epoxy resin, an elastomer, a photopolymerization initiator, a diluent and a curing agent, can give high performance cured film | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2003-06-24 | — | — | US | disclosed |
| US-20030087189-A1 | Flexibility, heat resistance, waterproofing, bonding strength; mixture of photosensitve resin, epoxy resin, photoinitiator | SHOWA DENKO K.K. (JP) | 2003-05-08 | — | — | US | disclosed |
| US-20020169226-A1 | Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such film | SATO KUNIAKI (JP) | 2002-11-14 | — | — | US | disclosed |
| US-20010053437-A1 | Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such film | SATO KUNIAKI (JP) | 2001-12-20 | — | — | US | disclosed |
| US-20010003759-A1 | PHOTO CURABLE RESIN COMPOSITION AND PHOTOSENSITIVE ELEMENT | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2001-06-14 | — | — | US | disclosed |
| US-6238840-B1 | CURABLE SOLDER RESIST COMPRISING A PHOTOSENSITIVE RESIN HAVING ONE OR MORE CARBOXYL GROUPS, A PHENOLIC DIGLYCIDYL ETHER EPOXY CURING AGENT, AND A PHOTOINITIATOR; ADHESION, HEAT RESISTANCE, RESOLUTION | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2001-05-29 | — | — | US | disclosed |
| EP-0919873-A1 | Photo curable resin composition and photosensitive element | HITACHI CHEMICAL CO., LTD. (JP) | 1999-06-02 | — | — | EP | disclosed |
| EP-0915383-A2 | Photosensitive resin composition | HITACHI CHEMICAL CO., LTD. (JP) | 1999-05-12 | — | — | EP | disclosed |