SCHEMBL2362250

SCHEMBL2362250

CCCCO[SiH]1CCCCO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31286 0.96 ALDH1A1 (0.32)
SCHEMBL28435101 0.94 ALDH1A1 (0.34)
SCHEMBL2774304 0.94 ALDH1A1 (0.34)
SCHEMBL28448662 0.94 ALDH1A1 (0.34)
Methyl Alcohol SCHEMBL5943614 0.91 TSHR (0.33)
SCHEMBL10621287 0.88
SCHEMBL169744 0.79
SCHEMBL11490936 0.78
SCHEMBL10875464 0.78
SCHEMBL10875453 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6830816-B2 For preparing lacquer DEGUSSA AG (DE) 2004-12-14 US claimed
US-20040096774-A1 Demonstration kit and method for enhancing and/or demonstrating photoactive properties PPG INDUSTRIES OHIO INC. 2004-05-20 US claimed
US-20030008974-A1 Highly filled, pasty, composition containing silicoorganic nanohybrid and/or microhybrid capsules for scratch-resistant and/or abrasion-resistant coatings DEGUSSA AG (DE) 2003-01-09 US claimed
EP-1249470-A2 Highly filled pasty siliconorganic nano and/or microhybridcapsules containing composition for scratch and/or abrasion resistant coatings Degussa AG (DE) 2002-10-16 EP claimed
JP-8286002-A None JP disclosed
JP-7152156-A None JP disclosed
US-20240101721-A1 HYDROPHOBICALLY-MODIFIED POLYSACCHARIDES AND USES THEREOF RHODIA OPERATIONS (FR) 2024-03-28 US disclosed
CN-114555648-A Hydrophobically modified polysaccharides and uses thereof 罗地亚经营管理公司 2022-05-27 CN disclosed
WO-2021072012-A1 HYDROPHOBICALLY-MODIFIED POLYSACCHARIDES AND USES THEREOF RHODIA OPERATIONS (FR) 2021-04-15 WO disclosed
US-10906018-B2 Method for the encapsulation of substances in silica-based capsules and the products obtained thereof DWI - LEIBNIZ-INSTITUT FÜR INTERAKTIVE MATERIALIEN E.V. 2021-02-02 US disclosed
US-10741316-B2 Ferromagnetic powder composition and method for its production HÖGANÄS AB (PUBL) (SE) 2020-08-11 US disclosed
EP-3328534-B1 METHOD FOR THE ENCAPSULATION OF SUBSTANCES IN SILICA-BASED CAPSULES AND THE PRODUCTS OBTAINED THEREOF DWI LEIBNIZ INSTITUT FUER INTERAKTIVE MAT E V (DE) 2019-09-04 EP disclosed
US-6830816-B2 For preparing lacquer DEGUSSA AG (DE) 2004-12-14 US disclosed
US-6767982-B2 REACTING IN A FIRST STAGE AN ORGANOTRICHLOROSILANE OR A MIXTURE, WATER AND AN ALCOHOL AT 0-150 DEGREES C.; HYDROGEN CHLORIDE PRODUCT REMOVED; CRUDE PRODUCT TRANSFERRED TO REACTION DISTILLATION COLUMN; BOTTOMS RECOVERED DEGUSSA AG (DE) 2004-07-27 US disclosed
US-20030008974-A1 Highly filled, pasty, composition containing silicoorganic nanohybrid and/or microhybrid capsules for scratch-resistant and/or abrasion-resistant coatings DEGUSSA AG (DE) 2003-01-09 US disclosed
US-6444315-B1 ENCAPSULATION OF FLAME RETARDER DEGUSSA AG (DE) 2002-09-03 US disclosed
US-20020086907-A1 Continuous manufacturing process for organoalkoxysiloxanes DEGUSSA AG (DE) 2002-07-04 US disclosed
EP-0970985-A1 Surface modified flame retardants, process for their preparation and use thereof Degussa-Hüls Aktiengesellschaft (DE) 2000-01-12 EP disclosed
JP-H08286002-A PRODUCTION OF MICROLENS OKI ELECTRIC IND CO LTD 1996-11-01 JP disclosed
JP-H07152156-A RESIN COMPOSITION OKI ELECTRIC IND CO LTD 1995-06-16 JP disclosed