⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8061677 | 1.00 | — | — | |
| SCHEMBL6344272 | 1.00 | — | — | |
| SCHEMBL5698034 | 1.00 | — | — | |
| SCHEMBL6335965 | 0.87 | — | — | |
| SCHEMBL10590188 | 0.87 | — | — | |
| SCHEMBL10898048 | 0.87 | — | — | |
| SCHEMBL7126165 | 0.87 | — | — | |
| SCHEMBL194648 | 0.87 | — | — | |
| SCHEMBL2170507 | 0.87 | — | — | |
| SCHEMBL5698023 | 0.87 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Appears in 5570 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12642121-B2 | Semiconductor device and semiconductor module | FUJI ELECTRIC CO., LTD. (JP) | 2026-05-26 | — | — | US | claimed |
| CN-122079488-A | Preparation method of cobalt-free black glaze for heat-resistant pot and decorative product thereof | — | 2026-05-26 | — | — | CN | claimed |
| CN-117144307-B | Preparation method of aluminum-silicon-copper sputtering target material | Ningbo Tongchuang Purun New Materials Co.,Ltd. (CN) | 2026-05-26 | — | — | CN | claimed |
| CN-115635088-B | Particle size pre-judging and parameter screening method for water atomization silicon-aluminum-copper alloy powder | SHANXI WOTE HAIMER NEW MATERIALS TECHNOLOGY Co.,Ltd. (CN) | 2026-05-26 | — | — | CN | claimed |
| WO-2026101565-A1 | THIN FILM RESISTOR AND THIN FILM METAL-INSULATOR-METAL CAPACITOR IN INTEGRATED CIRCUIT | MICROCHIP TECHNOLOGY INCORPORATED (US) | 2026-05-15 | — | — | WO | claimed |
| WO-2026101747-A1 | THIN FILM RESISTOR AND THIN FILM METAL-INSULATOR-METAL CAPACITOR USING SACRIFICIAL OXIDE FOR ALUMINUM BACKEND PROCESS | MICROCHIP TECHNOLOGY INCORPORATED (US) | 2026-05-15 | — | — | WO | claimed |
| CN-122012997-A | Superfine crystal aluminum silicon copper target material and preparation method thereof | 云南省贵金属新材料控股集团股份有限公司 | 2026-05-12 | — | — | CN | claimed |
| CN-122016954-A | Biosensor and method for manufacturing same | 向前生物科技股份有限公司 | 2026-05-12 | — | — | CN | claimed |
| CN-122028645-A | Method for improving noise of three-dimensional anisotropic magneto-resistive sensor product and product | 上海华虹宏力半导体制造有限公司 | 2026-05-12 | — | — | CN | claimed |
| US-20260124614-A1 | BIOSENSOR AND METHOD OF MANUFACTURING THE SAME | LEAP BIOCHIP CO LTD (TW) | 2026-05-07 | — | — | US | claimed |
| US-4476911-A | Diecasting method for producing cast pieces which are low in gas, pores and oxides, as well as diecasting machine for implementing the method | MASCHINENFABRIK MULLER-WEINGARTEN A.G. (DE) | 1984-10-16 | — | — | US | claimed |
| US-4451971-A | Lift-off wafer processing | FAIRCHILD CAMERA AND INSTRUMENT CORPORATION (US) | 1984-06-05 | — | — | US | claimed |
| US-4451326-A | Method for interconnecting metallic layers | ADVANCED MICRO DEVICES, INC. (US) | 1984-05-29 | — | — | US | claimed |
| EP-0013728-B1 | METHOD FOR FORMING ELECTRICAL CONNECTIONS BETWEEN CONDUCTING LAYERS IN SEMICONDUCTOR STRUCTURES | International Business Machines Corporation (US) | 1984-03-21 | — | — | EP | claimed |
| EP-0100736-A2 | Structure and process for lift-off wafer processing | FAIRCHILD SEMICONDUCTOR CORPORATION (US) | 1984-02-15 | — | — | EP | claimed |
| US-4410622-A | Forming interconnections for multilevel interconnection metallurgy systems | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1983-10-18 | — | — | US | claimed |
| US-4321284-A | Manufacturing method for semiconductor device | VLSI TECHNOLOGY RESEARCH ASSOCIATION (JP) | 1982-03-23 | — | — | US | claimed |
| US-4062720-A | Process for forming a ledge-free aluminum-copper-silicon conductor structure | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1977-12-13 | — | — | US | claimed |
| US-4035276-A | RADIO FREQUENCY SPUTTERING, CONDUCTORS, INSULATORS | IBM CORPORATION (US) | 1977-07-12 | — | — | US | claimed |
| US-4029562-A | SEMICONDUCTORS | IBM CORPORATION (US) | 1977-06-14 | — | — | US | claimed |