⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8061677 | 1.00 | — | — | |
| SCHEMBL236281 | 1.00 | — | — | |
| SCHEMBL6344272 | 1.00 | — | — | |
| SCHEMBL6335965 | 0.87 | — | — | |
| SCHEMBL10590188 | 0.87 | — | — | |
| SCHEMBL10898048 | 0.87 | — | — | |
| SCHEMBL7126165 | 0.87 | — | — | |
| SCHEMBL194648 | 0.87 | — | — | |
| SCHEMBL2170507 | 0.87 | — | — | |
| SCHEMBL5698023 | 0.87 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-120115878-A | Al-based ternary near-eutectic ribbon-shaped brazing filler metal with high Cu content and preparation method thereof | 河南省科学院材料研究所 | 2025-06-10 | — | — | CN | disclosed |
| CN-120115878-A | Al-based ternary near-eutectic ribbon-shaped brazing filler metal with high Cu content and preparation method thereof | 河南省科学院材料研究所 | 2025-06-10 | — | — | CN | disclosed |
| CN-112680626-B | Preparation process of copper-aluminum-silicon alloy target material for integrated circuit | 爱发科电子材料（苏州）有限公司 | 2022-12-02 | — | — | CN | disclosed |
| CN-112680626-A | Preparation process of copper-aluminum-silicon alloy target material for integrated circuit | 爱发科电子材料（苏州）有限公司 | 2021-04-20 | — | — | CN | disclosed |
| EP-0886312-B1 | Ceramics joint structure and method of producing the same | NGK INSULATORS LTD (JP) | 2006-06-07 | — | — | EP | disclosed |
| US-6617514-B1 | Ceramics joint structure and method of producing the same | NGK INSULATORS, LTD. (JP) | 2003-09-09 | — | — | US | disclosed |
| EP-0886312-A2 | Ceramics joint structure and method of producing the same | NGK INSULATORS, LTD. (JP) | 1998-12-23 | — | — | EP | disclosed |