⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Water SCHEMBL2364096 | 0.98 | — | — | |
| SCHEMBL9435789 | 0.71 | — | — | |
| Ammonia Solution, Strong SCHEMBL16531891 | 0.71 | — | — | |
| SCHEMBL3519315 | 0.68 | — | — | |
| SCHEMBL1359275 | 0.68 | — | — | |
| SCHEMBL1082877 | 0.64 | — | — | |
| SCHEMBL15272666 | 0.62 | — | — | |
| SCHEMBL132526 | 0.58 | — | — | |
| SCHEMBL465400 | 0.58 | — | — | |
| SCHEMBL3517566 | 0.57 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9476019-B2 | Cleaning agent for semiconductor provided with metal wiring | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2016-10-25 | — | — | US | disclosed |
| US-20150259632-A1 | CLEANING AGENT FOR SEMICONDUCTOR PROVIDED WITH METAL WIRING | TRUIST BANK, AS NOTES COLLATERAL AGENT | 2015-09-17 | — | — | US | disclosed |
| US-9045717-B2 | Cleaning agent for semiconductor provided with metal wiring | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2015-06-02 | — | — | US | disclosed |
| US-20150045277-A1 | POST-CMP FORMULATION HAVING IMPROVED BARRIER LAYER COMPATIBILITY AND CLEANING PERFORMANCE | ENTEGRIS, INC. (US) | 2015-02-12 | — | — | US | disclosed |
| EP-2828371-A1 | POST-CMP FORMULATION HAVING IMPROVED BARRIER LAYER COMPATIBILITY AND CLEANING PERFORMANCE | Entegris, Inc. (US) | 2015-01-28 | — | — | EP | disclosed |
| WO-2013142250-A1 | POST-CMP FORMULATION HAVING IMPROVED BARRIER LAYER COMPATIBILITY AND CLEANING PERFORMANCE | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2013-09-26 | — | — | WO | disclosed |
| WO-2013138278-A1 | COPPER CLEANING AND PROTECTION FORMULATIONS | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2013-09-19 | — | — | WO | disclosed |
| US-20130203643-A1 | CLEANING AGENT FOR SEMICONDUCTOR PROVIDED WITH METAL WIRING | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2013-08-08 | — | — | US | disclosed |
| WO-2011094568-A2 | CLEANING AGENT FOR SEMICONDUCTOR PROVIDED WITH METAL WIRING | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2011-08-04 | — | — | WO | disclosed |