SCHEMBL23647296

SCHEMBL23647296

C=CC(=O)OC(C)COC(=O)CCCCC(=O)OCC(C)OC(=O)C=C

nearest known ligand 0.52

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.52
MAPT P10636 1/20 0.49
LMNA P02545 2/20 0.44
ALDH1A1 P00352 1/20 0.44
PRKCA P17252 4/20 0.41
PRKCE Q02156 2/20 0.41
PRKCQ Q04759 2/20 0.41
PRKCD Q05655 2/20 0.41
CYP3A4 P08684 1/20 0.40
ATM Q13315 1/20 0.40
TDP1 Q9NUW8 1/20 0.40
KDM4E B2RXH2 1/20 0.39
DUSP3 P51452 1/20 0.39
MEN1 O00255 1/20 0.39
KMT2A Q03164 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7761789 0.97 TSHR (0.52) TSHRMAPTLMNAALDH1A1PRKCA
SCHEMBL27641861 0.94 TSHR (0.46) TSHRMAPTLMNAALDH1A1PRKCA
SCHEMBL1151186 0.93 TSHR (0.55) TSHRMAPTLMNAALDH1A1PRKCA
SCHEMBL7761791 0.91 TSHR (0.46) TSHRMAPTLMNAALDH1A1PRKCA
SCHEMBL19717886 0.87 MAPT (0.56) TSHRMAPTLMNAALDH1A1PRKCA
SCHEMBL17696340 0.87 TSHR (0.49) TSHRMAPTLMNAALDH1A1CYP3A4
SCHEMBL19845084 0.87 TSHR (0.49) TSHRMAPTLMNAALDH1A1PRKCA
SCHEMBL1071857 0.87 TSHR (0.49) TSHRMAPTLMNAALDH1A1PRKCA
SCHEMBL19845081 0.87 TSHR (0.49) TSHRMAPTLMNAALDH1A1PRKCA
SCHEMBL7761807 0.86 TSHR (0.55) TSHRMAPTALDH1A1PRKCACYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11794381-B2 Laser-debondable composition, laminate thereof, and laser-debonding method DAXIN MATERIALS CORPORATION (TW) 2023-10-24 US disclosed
CN-113214588-B Composition capable of laser releasing, laminate thereof and laser releasing method 达兴材料股份有限公司 2022-10-04 CN disclosed
US-20210221032-A1 LASER-DEBONDABLE COMPOSITION, LAMINATE THEREOF, AND LASER-DEBONDING METHOD DAXIN MATERIALS CORPORATION (TW) 2021-07-22 US disclosed