SCHEMBL23668239

SCHEMBL23668239

C(CCCCCCOCC1CO1)CCCCCCOCC1CO1

nearest known ligand 0.95

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.95
ALDH1A1 P00352 5/20 0.79
TDP1 Q9NUW8 2/20 0.79
SMN1; SMN2 Q16637 1/20 0.71
MAPK1 P28482 1/20 0.48
TP53 P04637 1/20 0.38
CYP3A4 P08684 1/20 0.38
SPHK2 Q9NRA0 4/20 0.37
SPHK1 Q9NYA1 4/20 0.37
MEN1 O00255 1/20 0.36
KMT2A Q03164 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15084995 1.00 TSHR (0.95) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL28763664 1.00 TSHR (0.95) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL12805060 1.00 TSHR (0.95) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL262589 1.00 TSHR (0.95) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL890477 1.00 TSHR (0.95) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL262140 1.00 TSHR (0.95) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL15215 1.00 TSHR (0.95) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL21834095 1.00 TSHR (0.95) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL20543294 1.00 TSHR (0.95) TSHRALDH1A1TDP1SMN1; SMN2MAPK1
SCHEMBL2784183 1.00 TSHR (0.95) TSHRALDH1A1TDP1SMN1; SMN2MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118159581-A Epoxy resin composition, cured product thereof, and laminate DIC株式会社 2024-06-07 CN disclosed
US-20240059827-A1 EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND LAMINATE DIC CORPORATION (JP) 2024-02-22 US disclosed
CN-116948179-A Modified cage-type oligomeric silsesquioxane, organic silicon sealant and preparation method thereof, flexible semiconductor device and film packaging method 深圳市首骋新材料科技有限公司 2023-10-27 CN disclosed
CN-116925121-A Organopolysiloxane, organopolysiloxane composition, method for producing the same, flexible semiconductor device, and film encapsulation method for the same 深圳市首骋新材料科技有限公司 2023-10-24 CN disclosed
CN-116925122-A Organosiloxane monomer, organosiloxane sealant, preparation method thereof, thin film packaging method and flexible semiconductor device 深圳市首骋新材料科技有限公司 2023-10-24 CN disclosed
EP-4261037-A1 EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND LAMINATE DIC Corporation (JP) 2023-10-18 EP disclosed
EP-3730531-B1 EPOXY COMPOUND, COMPOSITION, CURED PRODUCT AND LAMINATE DAINIPPON INK & CHEMICALS (JP) 2023-10-04 EP disclosed
CN-116829353-A Epoxy resin composition, cured product thereof, and laminate DIC株式会社 2023-09-29 CN disclosed
US-11760711-B2 Epoxy compound, composition, cured product and laminate DIC CORPORATION (JP) 2023-09-19 US disclosed
US-11685807-B2 Resin composition, cured product, laminate, and electronic member DIC CORPORATION (JP) 2023-06-27 US disclosed
CN-112236477-B Resin composition, cured product, laminate, and electronic component DIC株式会社 2023-06-23 CN disclosed
WO-2023095615-A1 EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND LAMINATE DIC株式会社 2023-06-01 WO disclosed
CN-111566141-B Epoxy compound, composition, cured product, and laminate DIC株式会社 2023-05-02 CN disclosed
EP-3854848-B1 RESIN COMPOSITION, CURED OBJECT, AND LAMINATE DAINIPPON INK & CHEMICALS (JP) 2023-01-25 EP disclosed
CN-111527063-B Hydroxyl compound, composition, cured product, and laminate DIC株式会社 2022-11-08 CN disclosed
EP-3854848-A1 RESIN COMPOSITION, CURED OBJECT, AND LAMINATE DIC Corporation (JP) 2021-07-28 EP disclosed
CN-112236477-A Resin composition, cured product, and laminate DIC株式会社 2021-01-15 CN disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11760711-B2 Epoxy compound, composition, cured product and laminate ARL1, DOT1L, RFT1 TSHR 4665/4885ALDH1A1 1078/4885TDP1 3627/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.