⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7864301 | 1.00 | — | — | |
| SCHEMBL7861502 | 1.00 | — | — | |
| SCHEMBL7856002 | 1.00 | — | — | |
| SCHEMBL1000795 | 0.97 | — | — | |
| SCHEMBL7863774 | 0.92 | — | — | |
| SCHEMBL1333713 | 0.81 | — | — | |
| SCHEMBL14621567 | 0.78 | POLB (0.34) | — | |
| SCHEMBL10689901 | 0.72 | ALDH1A1 (0.35) | — | |
| SCHEMBL14446340 | 0.68 | — | — | |
| SCHEMBL9926357 | 0.68 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8268158-B2 | Plating bath and method | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2012-09-18 | — | — | US | claimed |
| US-8262895-B2 | Plating bath and method | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2012-09-11 | — | — | US | claimed |
| EP-0740679-B1 | CROSSLINKED POLYMERIC AMMONIUM SALTS | DU PONT (US) | 2001-08-08 | — | — | EP | claimed |
| US-5874522-A | FORMING CROSSLINKED POLYMERIC AMMONIUM SALT OR POLYMERIC AMINE IN SOLVENT, WHEREIN TEMPLATE COMPRISING SACCHARIDE OR ORGANIC METAL SALT IS PRESENT WHEN THE CROSSLINKED POLYMERIC AMMONIUM SALT OR POLYMERIC AMINE GELS; BILE ACID SEQUESTRANTS | DUPONT PHARMACEUTICALS COMPANY (US) | 1999-02-23 | — | — | US | claimed |
| US-5726284-A | Crosslinked polymric ammonium salts | THE DUPONT MERCK PHARMACEUTICAL COMPANY (US) | 1998-03-10 | — | — | US | claimed |
| EP-0740679-A1 | CROSSLINKED POLYMERIC AMMONIUM SALTS | E.I. DU PONT DE NEMOURS & COMPANY INCORPORATED (US) | 1996-11-06 | — | — | EP | claimed |
| US-5556619-A | BILE ACID SEQUESTERANTS TO LOWER BLOOD CHOLESTEROL, POLYAMINES | THE DU PONT MERCK PHARMACEUTICAL COMPANY (US) | 1996-09-17 | — | — | US | claimed |
| WO-1995019384-A1 | CROSSLINKED POLYMERIC AMMONIUM SALTS | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1995-07-20 | — | — | WO | claimed |
| US-10718059-B2 | Nickel electroplating compositions with cationic polymers and methods of electroplating nickel | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2020-07-21 | — | — | US | disclosed |
| US-10711360-B2 | Nickel electroplating compositions with copolymers of arginine and bisepoxides and methods of electroplating nickel | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2020-07-14 | — | — | US | disclosed |
| EP-3428322-B1 | NICKEL ELECTROPLATING COMPOSITIONS WITH COPOLYMERS OF ARGININE AND BISEPOXIDES AND METHODS OF ELECTROPLATING NICKEL | ROHM & HAAS ELECT MAT (US) | 2019-08-21 | — | — | EP | disclosed |
| EP-3428323-B1 | NICKEL ELECTROPLATING COMPOSITIONS WITH CATIONIC POLYMERS AND METHODS OF ELECTROPLATING NICKEL | ROHM & HAAS ELECT MAT (US) | 2019-08-21 | — | — | EP | disclosed |
| US-20190017187-A1 | NICKEL ELECTROPLATING COMPOSITIONS WITH COPOLYMERS OF ARGININE AND BISEPOXIDES AND METHODS OF ELECTROPLATING NICKEL | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2019-01-17 | — | — | US | disclosed |
| EP-3428323-A1 | NICKEL ELECTROPLATING COMPOSITIONS WITH CATIONIC POLYMERS AND METHODS OF ELECTROPLATING NICKEL | Rohm and Haas Electronic Materials LLC (US) | 2019-01-16 | — | — | EP | disclosed |
| US-8262895-B2 | Plating bath and method | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2012-09-11 | — | — | US | disclosed |
| EP-2465976-A1 | Method of electroplating uniform copper layer on the edge and walls of though holes of a substrate | Rohm and Haas Electronic Materials LLC (US) | 2012-06-20 | — | — | EP | disclosed |
| EP-2366694-A2 | Copper electropating bath and method | Rohm and Haas Electronic Materials LLC (US) | 2011-09-21 | — | — | EP | disclosed |
| EP-2366692-A2 | Copper electropating bath and method | Rohm and Haas Electronic Materials LLC (US) | 2011-09-21 | — | — | EP | disclosed |
| US-20110220513-A1 | Plating bath and method | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2011-09-15 | — | — | US | disclosed |
| US-20110220512-A1 | Plating bath and method | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2011-09-15 | — | — | US | disclosed |