SCHEMBL2367732

SCHEMBL2367732

CCCCCCCCCCCCCCCCCCCO[SiH3]

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
THRB P10828 2/20 0.50
TSHR P16473 1/20 0.50
MEN1 O00255 1/20 0.44
HTT P42858 1/20 0.44
KMT2A Q03164 1/20 0.44
MAPT P10636 1/20 0.44
CA1 P00915 8/20 0.42
CA2 P00918 8/20 0.42
CA9 Q16790 7/20 0.42
LPAR3 Q9UBY5 6/20 0.42
LPAR2 Q9HBW0 5/20 0.42
CA12 O43570 3/20 0.42
CA7 P43166 3/20 0.42
CA14 Q9ULX7 3/20 0.42
LPAR1 Q92633 2/20 0.42
CA3 P07451 2/20 0.42
CA4 P22748 2/20 0.42
CA6 P23280 2/20 0.42
CA5A P35218 2/20 0.42
CA5B Q9Y2D0 2/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10606060 1.00 THRB (0.50) THRBTSHRMEN1HTTKMT2A
SCHEMBL613295 1.00 THRB (0.50) THRBTSHRMEN1HTTKMT2A
SCHEMBL705780 1.00 THRB (0.50) THRBTSHRMEN1HTTKMT2A
SCHEMBL707613 1.00
SCHEMBL28459692 1.00 THRB (0.50) THRBTSHRMEN1HTTKMT2A
SCHEMBL1614339 1.00 THRB (0.50) THRBTSHRMEN1HTTKMT2A
SCHEMBL703266 1.00
SCHEMBL2969349 1.00 THRB (0.50) THRBTSHRMEN1HTTKMT2A
SCHEMBL1389233 1.00 THRB (0.50) THRBTSHRMEN1HTTKMT2A
SCHEMBL3173910 1.00 THRB (0.50) THRBTSHRMEN1HTTKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110144158-B Single-component polymer nano composite super-hydrophobic coating material and preparation method thereof 安徽大学 2021-08-20 CN claimed
CN-112724715-A Organic composite super-hydrophobic coating and preparation method thereof 厦门华厦学院 2021-04-30 CN claimed
US-20240376295-A1 TREATED INORGANIC PARTICLES FOR MODIFYING POLYMER CRYSTALLINITY THE CHEMOURS COMPANY FC, LLC (US) 2024-11-14 US disclosed
EP-4384578-A1 TREATED INORGANIC PARTICLES FOR MODIFYING POLYMER CRYSTALLINITY The Chemours Company FC, LLC (US) 2024-06-19 EP disclosed
WO-2023018616-A1 TREATED INORGANIC PARTICLES FOR MODIFYING POLYMER CRYSTALLINITY THE CHEMOURS COMPANY FC, LLC (US) 2023-02-16 WO disclosed
US-20220105540-A1 AQUEOUS SLURRIES, COATINGS AND COATED ARTICLES WITH HYDROPHOBIC INORGANIC PARTICLES AND METAL SALTS THE CHEMOURS COMPANY FC, LLC (US) 2022-04-07 US disclosed
EP-3924434-A1 AQUEOUS SLURRIES, COATINGS AND COATED ARTICLES WITH HYDROPHOBIC INORGANIC PARTICLES AND METAL SALTS The Chemours Company FC, LLC (US) 2021-12-22 EP disclosed
CN-113439110-A Aqueous slurry, coating and coated article with hydrophobic inorganic particles and metal salt 科慕埃弗西有限公司 2021-09-24 CN disclosed
CN-110144158-B Single-component polymer nano composite super-hydrophobic coating material and preparation method thereof 安徽大学 2021-08-20 CN disclosed
CN-110144158-B Single-component polymer nano composite super-hydrophobic coating material and preparation method thereof 安徽大学 2021-08-20 CN disclosed
CN-113008973-A Protein chip suitable for detecting low-abundance protein and preparation method and application thereof 融智生物科技(青岛)有限公司 2021-06-22 CN disclosed
EP-1832406-B1 MOLDING DIE OR MASTER PATTERN FOR ELECTROFORMING HAVING RELEASE LAYER NIPPON SODA CO (JP) 2014-06-04 EP disclosed
US-8361375-B2 Forming mold or electroforming mother die having release layer and method for manufacturing the same NIPPON SODA CO., LTD. (JP) 2013-01-29 US disclosed
US-20120126448-A1 FORMING MOLD OR ELECTROFORMING MOTHER DIE HAVING RELEASE LAYER AND METHOD FOR MANUFACTURING THE SAME NIPPON SODA CO., LTD. (JP) 2012-05-24 US disclosed
EP-2366521-A2 MOLDING DIE OR MASTER PATTERN FOR ELECTROFORMING EACH HAVING RELEASE LAYER Nippon Soda Co., Ltd. (JP) 2011-09-21 EP disclosed
US-20080290249-A1 Forming Mold Or Electroforming Mother Die Having Release Layer And Method For Manufacturing The Same NIPPON SODA CO., LTD. (JP) 2008-11-27 US disclosed
EP-1832406-A1 MOLDING DIE OR MASTER PATTERN FOR ELECTROFORMING EACH HAVING RELEASE LAYER NIPPON SODA CO., LTD. (JP) 2007-09-12 EP disclosed
EP-0886186-B1 Image forming method and use of a specific developer in an image forming apparatus CANON KK (JP) 2003-11-12 EP disclosed
US-6137977-A Image forming method and image forming apparatus using specific developer composition CANON KABUSHIKI KAISHA 2000-10-24 US disclosed
EP-0886186-A1 Image forming method and image forming apparatus CANON KABUSHIKI KAISHA (JP) 1998-12-23 EP disclosed