SCHEMBL23720647

SCHEMBL23720647

CC1=CC=C(OC(=O)c2ccc(C(=O)Oc3ccc(C)cc3)cc2)CC1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 10/20 0.50
LMNA P02545 2/20 0.50
PRSS1 P07477 1/20 0.50
ACR P10323 1/20 0.50
MEN1 O00255 3/20 0.48
GBA1 P04062 1/20 0.46
ALDH1A1 P00352 3/20 0.46
HPGD P15428 2/20 0.46
CYP1A2 P05177 1/20 0.46
CYP2C9 P11712 1/20 0.46
MAPT P10636 1/20 0.46
SRD5A1 P18405 1/20 0.43
SRD5A2 P31213 1/20 0.43
TDP1 Q9NUW8 1/20 0.42
NPC1 O15118 2/20 0.42
SMN1; SMN2 Q16637 2/20 0.42
RAB9A P51151 1/20 0.42
RXFP1 Q9HBX9 1/20 0.42
GAA P10253 1/20 0.41
SLC6A2 P23975 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14515831 0.87 KMT2A (0.55) KMT2ALMNAPRSS1ACRMEN1
SCHEMBL2741098 0.80 PRSS1 (0.69) KMT2ALMNAPRSS1ACRMEN1
SCHEMBL9663961 0.80 PRSS1 (0.69) KMT2ALMNAPRSS1ACRMEN1
SCHEMBL8930157 0.80 PRSS1 (0.69) KMT2ALMNAPRSS1ACRMEN1
SCHEMBL1101878 0.80 PRSS1 (0.69) KMT2ALMNAPRSS1ACRMEN1
SCHEMBL8929987 0.80 PRSS1 (0.69) KMT2ALMNAPRSS1ACRMEN1
SCHEMBL19628299 0.80 KMT2A (0.45) KMT2ALMNAPRSS1ACRMEN1
SCHEMBL18915022 0.78 NPC1 (0.42) KMT2ALMNAPRSS1ACRMEN1
SCHEMBL2741097 0.76 PRSS1 (0.63) KMT2ALMNAPRSS1ACRMEN1
SCHEMBL14346600 0.76 PRSS1 (0.63) KMT2ALMNAPRSS1ACRMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3858885-A1 COMPOSITION FOR FORMING HEAT CONDUCTIVE MATERIALS, HEAT CONDUCTIVE MATERIAL, HEAT CONDUCTIVE SHEET, DEVICE WITH HEAT CONDUCTIVE LAYER, AND FILM FUJIFILM Corporation (JP) 2021-08-04 EP disclosed