SCHEMBL23720649

SCHEMBL23720649

OCc1ccc(OCCCOCC2CO2)cc1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.50
SMN1; SMN2 Q16637 2/20 0.49
HRH3 Q9Y5N1 3/20 0.46
TDP1 Q9NUW8 2/20 0.44
ALDH1A1 P00352 5/20 0.42
MEN1 O00255 4/20 0.42
KMT2A Q03164 4/20 0.42
TP53 P04637 3/20 0.42
MAPT P10636 2/20 0.42
HPGD P15428 2/20 0.42
HIF1A Q16665 2/20 0.42
PKM P14618 2/20 0.42
CYP1A2 P05177 1/20 0.42
PPARG P37231 1/20 0.42
LMNA P02545 1/20 0.42
GAA P10253 1/20 0.42
CYP3A4 P08684 1/20 0.39
CYP2D6 P10635 1/20 0.37
RAB9A P51151 1/20 0.37
ACHE P22303 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9322136 0.85 TSHR (0.69) TSHRSMN1; SMN2HRH3TDP1ALDH1A1
SCHEMBL16153915 0.85 TDP1 (0.51) TSHRSMN1; SMN2HRH3TDP1ALDH1A1
SCHEMBL4563641 0.84 TDP1 (0.61) TSHRSMN1; SMN2HRH3TDP1ALDH1A1
SCHEMBL731015 0.82 TSHR (0.45) TSHRSMN1; SMN2TDP1ALDH1A1TP53
SCHEMBL10331086 0.81 SMN1; SMN2 (0.56) TSHRSMN1; SMN2TDP1ALDH1A1MEN1
SCHEMBL11682636 0.81 TDP1 (0.68) TSHRSMN1; SMN2TDP1ALDH1A1MEN1
SCHEMBL9325190 0.80 TDP1 (0.55) TSHRSMN1; SMN2TDP1ALDH1A1MEN1
SCHEMBL27130914 0.80 TDP1 (0.53) TSHRSMN1; SMN2TDP1ALDH1A1MEN1
SCHEMBL12129471 0.80 TDP1 (0.56) TSHRSMN1; SMN2TDP1ALDH1A1MEN1
SCHEMBL17826371 0.80 TDP1 (0.56) TSHRSMN1; SMN2HRH3TDP1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3858885-A1 COMPOSITION FOR FORMING HEAT CONDUCTIVE MATERIALS, HEAT CONDUCTIVE MATERIAL, HEAT CONDUCTIVE SHEET, DEVICE WITH HEAT CONDUCTIVE LAYER, AND FILM FUJIFILM Corporation (JP) 2021-08-04 EP disclosed