SCHEMBL23749099

SCHEMBL23749099

C=C(C(=O)OC1CCCC1)C(=O)OC1CCCC1

nearest known ligand 0.43

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
EPHX1 P07099 2/20 0.43
CA12 O43570 2/20 0.39
CA1 P00915 2/20 0.39
CA2 P00918 2/20 0.39
CA9 Q16790 2/20 0.39
NAAA Q02083 2/20 0.38
CYP2C19 P33261 1/20 0.38
HTT P42858 1/20 0.36
CYP19A1 P11511 4/20 0.36
BCHE P06276 1/20 0.36
GPR35 Q9HC97 2/20 0.35
MMP1 P03956 1/20 0.33
MMP9 P14780 1/20 0.33
MMP12 P39900 1/20 0.33
FABP7 O15540 1/20 0.33
FABP5 Q01469 1/20 0.33
STS P08842 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6658383 0.98 EPHX1 (0.47) EPHX1CA12CA1CA2CA9
SCHEMBL6655840 0.87 EPHX1 (0.42) EPHX1CA12CA1CA2CA9
SCHEMBL28923330 0.85 EPHX1 (0.43) EPHX1CA12CA1CA2CA9
SCHEMBL11591531 0.84 EPHX1 (0.50) EPHX1CA12CA1CA2CA9
SCHEMBL7034602 0.83 EPHX1 (0.46) EPHX1NAAACYP2C19HTTCYP19A1
SCHEMBL23764754 0.83 EPHX1 (0.39) EPHX1CA12CA1CA2CA9
SCHEMBL324473 0.83 EPHX1 (0.42) EPHX1CA12CA1CA2CA9
SCHEMBL13762946 0.82 EPHX1 (0.36) EPHX1CA12CA1CA2CA9
SCHEMBL2999385 0.81 EPHX1 (0.54) EPHX1CA12CA1CA2CA9
SCHEMBL6623051 0.81 EPHX1 (0.48) EPHX1CA12CA1CA2CA9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3865520-B1 CURING AGENT COMPOSITION FOR CURING 2-METHYLENE-1,3-DICARBONYL COMPOUND NAMICS CORP (JP) 2024-02-28 EP disclosed
CN-112789299-B Curing agent composition for curing 2-methylene-1, 3-dicarbonyl compounds 纳美仕有限公司 2023-02-21 CN disclosed
US-20210388128-A1 CURING AGENT COMPOSITION FOR CURING 2-METHYLENE-1,3-DICARBONYL COMPOUND NAMICS CORPORATION (JP) 2021-12-16 US disclosed
EP-3865520-A1 CURING AGENT COMPOSITION FOR CURING 2-METHYLENE-1,3-DICARBONYL COMPOUND Namics Corporation (JP) 2021-08-18 EP disclosed
CN-112789299-A Curing agent composition for curing 2-methylene-1, 3-dicarbonyl compounds 纳美仕有限公司 2021-05-11 CN disclosed