Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA1 | P00915 | 7/20 | 0.50 |
| ▸ | CA2 | P00918 | 7/20 | 0.50 |
| ▸ | CA9 | Q16790 | 5/20 | 0.50 |
| ▸ | CA7 | P43166 | 4/20 | 0.50 |
| ▸ | CA4 | P22748 | 3/20 | 0.50 |
| ▸ | CA6 | P23280 | 3/20 | 0.50 |
| ▸ | CA5A | P35218 | 3/20 | 0.50 |
| ▸ | CA5B | Q9Y2D0 | 3/20 | 0.50 |
| ▸ | TSHR | P16473 | 4/20 | 0.42 |
| ▸ | NT5E | P21589 | 1/20 | 0.42 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.39 |
| ▸ | MEN1 | O00255 | 1/20 | 0.39 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.39 |
| ▸ | CA12 | O43570 | 3/20 | 0.33 |
| ▸ | CA13 | Q8N1Q1 | 2/20 | 0.33 |
| ▸ | USP2 | O75604 | 1/20 | 0.30 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.30 |
| ▸ | AGO2 | Q9UKV8 | 1/20 | 0.30 |
| ▸ | CA14 | Q9ULX7 | 1/20 | 0.30 |
| ▸ | GMNN | O75496 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Sulfamate SCHEMBL15516480 | 0.94 | CA2 (0.56) | CA1CA2CA9CA7CA4 | |
| Sulfamate SCHEMBL4293177 | 0.89 | CA1 (0.50) | CA1CA2CA9CA7CA4 | |
| Sulfamate SCHEMBL1313117 | 0.89 | CA1 (0.50) | CA1CA2CA9CA7CA4 | |
| Sulfamate SCHEMBL16036622 | 0.89 | CA1 (0.50) | CA1CA2CA9CA7CA4 | |
| Sulfamate SCHEMBL21641874 | 0.89 | CA1 (0.50) | CA1CA2CA9CA7CA4 | |
| Sulfamate SCHEMBL23498393 | 0.89 | CA1 (0.50) | CA1CA2CA9CA7CA4 | |
| Sulfamate SCHEMBL898937 | 0.89 | CA1 (0.50) | CA1CA2CA9CA7CA4 | |
| Sulfamate SCHEMBL11227819 | 0.89 | CA1 (0.50) | CA1CA2CA9CA7CA4 | |
| Sulfamate SCHEMBL20658931 | 0.89 | CA1 (0.50) | CA1CA2CA9CA7CA4 | |
| Sulfamate SCHEMBL16034628 | 0.89 | CA1 (0.50) | CA1CA2CA9CA7CA4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1305 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122081911-A | High-stability electroless copper plating solution and preparation method and application thereof | — | 2026-05-26 | — | — | CN | claimed |
| CN-122013191-A | Environment-friendly recycling method for extracting copper, tin and lead from retired photovoltaic solder strip | 中国电器科学研究院股份有限公司 | 2026-05-12 | — | — | CN | claimed |
| US-12439528-B2 | Method of preparing a high density interconnect printed circuit board including microvias filled with copper | Atotech Deutschland GmbH & Co. KG (DE) | 2025-10-07 | — | — | US | claimed |
| CN-120005312-A | Antistatic high-molecular EVA foam composite material and preparation method thereof | 东莞市华创包装制品有限公司 | 2025-05-16 | — | — | CN | claimed |
| US-12245383-B2 | Method of preparing a high density interconnect printed circuit board including microvias filled with copper | Atotech Deutschland GmbH & Co. KG (DE) | 2025-03-04 | — | — | US | claimed |
| US-20240350690-A1 | ELECTROLESS ANTIPATHOGENIC COATING | MACDERMID, INCORPORATED | 2024-10-24 | — | — | US | claimed |
| US-20240341042-A1 | METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOARD INCLUDING MICROVIAS FILLED WITH COPPER | Atotech Deutschland GmbH & Co. KG (DE) | 2024-10-10 | — | — | US | claimed |
| EP-4441271-A1 | ELECTROLESS ANTIPATHOGENIC COATING | Coventya, Inc. (US) | 2024-10-09 | — | — | EP | claimed |
| EP-4011990-B1 | PRE-TREATMENT LIQUID FOR USE IN INK JET PRINTING | CANON PRODUCTION PRINTING HOLDING BV (NL) | 2024-09-11 | — | — | EP | claimed |
| CN-118451212-A | Chemical antipathogenic coatings | 科文特亚股份有限公司 | 2024-08-06 | — | — | CN | claimed |
| US-6350366-B1 | UNIFORM COATINGS ON SUBSTRATES AND TO PROVIDE SUBSTANTIALLY DEFECT FREE FILLING OF SMALL FEATURES | APPLIED MATERIALS, INC. | 2002-02-26 | — | — | US | claimed |
| US-20020011416-A1 | Electrodeposition chemistry for filling of apertures with reflective metal | APPLIED MATERIALS, INC. | 2002-01-31 | — | — | US | claimed |
| WO-2001096632-A2 | A METHOD AND APPARATUS FOR CONDITIONING ELECTROCHEMICAL BATHS IN PLATING TECHNOLOGY | APPLIED MATERIALS, INC. (US) | 2001-12-20 | — | — | WO | claimed |
| US-6113771-A | Electro deposition chemistry | APPLIED MATERIALS, INC. (US) | 2000-09-05 | — | — | US | claimed |
| WO-2000041518-A2 | ELECTRODEPOSITION CHEMISTRY FOR FILLING OF APERTURES WITH REFLECTIVE METAL | APPLIED MATERIALS, INC. (US) | 2000-07-20 | — | — | WO | claimed |
| EP-0952242-A1 | Electro deposition chemistry | Applied Materials, Inc. (US) | 1999-10-27 | — | — | EP | claimed |
| WO-1997034030-A1 | SOLUTION FOR GALVANIC POLISHING OF METAL JEWELRY | CARRARA GUISEPPE (IT) | 1997-09-18 | — | — | WO | claimed |
| US-5665679-A | COPPER-ETHYLENEDIAMINE COMPLEX | GRIFFIN CORPORATION (US) | 1997-09-09 | — | — | US | claimed |
| US-4101389-A | IRON, PHOSPHORUS | SONY CORPORATION (JP) | 1978-07-18 | — | — | US | claimed |
| US-4007037-A | Composition and method for chemically etching copper elements | GENERAL ELECTRIC COMPANY (US) | 1977-02-08 | — | — | US | claimed |