SCHEMBL2379667

SCHEMBL2379667

CC(C)=C/C(C)=C\[Ti]/C=C(/C)C=C(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2379668 1.00
SCHEMBL9509929 0.67
SCHEMBL9509932 0.67
SCHEMBL19509996 0.67
SCHEMBL30075932 0.65
SCHEMBL20605353 0.65
SCHEMBL5986869 0.62
SCHEMBL10400205 0.62
SCHEMBL12131649 0.62
SCHEMBL10400204 0.62

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20060169391-A1 Tire compositions and vulcanizates thereof having improved silica reinforcement BRIDGESTONE CORPORATION (JP) 2006-08-03 US claimed
US-5273783-A Chemical vapor deposition of titanium and titanium containing films using bis (2,4-dimethylpentadienyl) titanium as a precursor MICRON SEMICONDUCTOR, INC. (US) 1993-12-28 US claimed
EP-2259303-B1 Interfacial capping layers for interconnects NOVELLUS SYSTEMS INC (US) 2018-09-19 EP disclosed
US-20140216336-A1 METAL AND SILICON CONTAINING CAPPING LAYERS FOR INTERCONNECTS NOVELLUS SYSTEMS, INC. (US) 2014-08-07 US disclosed
US-8753978-B2 Metal and silicon containing capping layers for interconnects NOVELLUS SYSTEMS, INC. (US) 2014-06-17 US disclosed
US-20130143401-A1 METAL AND SILICON CONTAINING CAPPING LAYERS FOR INTERCONNECTS NOVELLUS SYSTEMS, INC. 2013-06-06 US disclosed
WO-2012167141-A2 METAL AND SILICON CONTAINING CAPPING LAYERS FOR INTERCONNECTS NOVELLUS SYSTEMS, INC. (US) 2012-12-06 WO disclosed
US-8268722-B2 Interfacial capping layers for interconnects NOVELLUS SYSTEMS, INC. (US) 2012-09-18 US disclosed
US-8017696-B2 Tire compositions and vulcanizates thereof having improved silica reinforcement BRIDGESTONE CORPORATION (JP) 2011-09-13 US disclosed
US-20100308463-A1 INTERFACIAL CAPPING LAYERS FOR INTERCONNECTS NOVELLUS SYSTEMS, INC. 2010-12-09 US disclosed
EP-2259303-A2 Interfacial capping layers for interconnects Novellus Systems, Inc. (US) 2010-12-08 EP disclosed
EP-0819706-A1 Process for the syndiotactic propagation of olefins FINA TECHNOLOGY, INC. (US) 1998-01-21 EP disclosed
US-5693377-A Method of reducing carbon incorporation into films produced by chemical vapor deposition involving titanium organometallic and metal-organic precursor compounds MICRON TECHNOLOGY, INC. (US) 1997-12-02 US disclosed
US-5693377-A Method of reducing carbon incorporation into films produced by chemical vapor deposition involving titanium organometallic and metal-organic precursor compounds MICRON TECHNOLOGY, INC. (US) 1997-12-02 US disclosed
WO-1996018660-A1 HYDROGENATION OF UNSATURATED POLYMERS USING DIVALENT NON-AROMATIC ANIONIC DIENYL-CONTAINING GROUP IV METAL CATALYSTS THE DOW CHEMICAL COMPANY (US) 1996-06-20 WO disclosed
WO-1996016094-A1 PREPARATION OF SYNDIOTACTIC POLYOLEFINS FROM PROCHIRAL OLEFINS THE DOW CHEMICAL COMPANY (US) 1996-05-30 WO disclosed
EP-0711846-A1 Titanium nitride deposited by chemical vapor deposition APPLIED MATERIALS, INC. (US) 1996-05-15 EP disclosed
US-5273783-A Chemical vapor deposition of titanium and titanium containing films using bis (2,4-dimethylpentadienyl) titanium as a precursor MICRON SEMICONDUCTOR, INC. (US) 1993-12-28 US disclosed
US-5200379-A Activating inorganic refractory by calcining in air, then contacting with catalyst complex to absorb catalyst onto refractory support PHILLIPS PETROLEUM COMPANY (US) 1993-04-06 US disclosed
US-5075394-A Controlling physical properties of polyolefins with catalyst PHILLIPS PETROLEUM COMPANY (US) 1991-12-24 US disclosed