Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA12 | O43570 | 5/20 | 0.44 |
| ▸ | CA6 | P23280 | 5/20 | 0.44 |
| ▸ | CA7 | P43166 | 5/20 | 0.44 |
| ▸ | CA9 | Q16790 | 5/20 | 0.44 |
| ▸ | CA14 | Q9ULX7 | 5/20 | 0.44 |
| ▸ | CA5B | Q9Y2D0 | 5/20 | 0.44 |
| ▸ | CA2 | P00918 | 4/20 | 0.44 |
| ▸ | CA4 | P22748 | 4/20 | 0.44 |
| ▸ | CA5A | P35218 | 4/20 | 0.44 |
| ▸ | CA3 | P07451 | 3/20 | 0.44 |
| ▸ | MEN1 | O00255 | 2/20 | 0.42 |
| ▸ | RECQL | P46063 | 2/20 | 0.42 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.42 |
| ▸ | LMNA | P02545 | 3/20 | 0.40 |
| ▸ | TDP1 | Q9NUW8 | 3/20 | 0.40 |
| ▸ | ALOX15 | P16050 | 3/20 | 0.40 |
| ▸ | CA1 | P00915 | 2/20 | 0.40 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.40 |
| ▸ | TP53 | P04637 | 1/20 | 0.40 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8372317 | 0.85 | CA12 (0.38) | CA12CA6CA7CA9CA14 | |
| SCHEMBL337042 | 0.80 | — | — | |
| SCHEMBL442661 | 0.78 | — | — | |
| SCHEMBL28399614 | 0.76 | CA12 (0.41) | CA12CA6CA7CA9CA14 | |
| SCHEMBL15466755 | 0.76 | DNM1 (0.38) | CA12CA6CA7CA9CA14 | |
| SCHEMBL8953948 | 0.76 | DNM1 (0.38) | CA12CA6CA7CA9CA14 | |
| SCHEMBL17444939 | 0.75 | CA12 (0.55) | CA12CA6CA7CA9CA14 | |
| SCHEMBL8376994 | 0.75 | CA12 (0.39) | CA12CA6CA7CA9CA14 | |
| SCHEMBL27557375 | 0.75 | CA12 (0.39) | CA12CA6CA7CA9CA14 | |
| SCHEMBL28773361 | 0.74 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-112625469-A | High-temperature-resistant metal plate adopting inorganic coating and preparation method thereof | 舾蒙新材料科技(上海)有限公司 | 2021-04-09 | — | — | CN | claimed |
| CN-112625468-A | Multifunctional composite coating and preparation method thereof | 舾蒙新材料科技(上海)有限公司 | 2021-04-09 | — | — | CN | claimed |
| CN-112625467-A | Self-demoulding mould and preparation method thereof | 舾蒙新材料科技(上海)有限公司 | 2021-04-09 | — | — | CN | claimed |
| CN-112625470-A | Normal-temperature curing inorganic coating and preparation method thereof | 舾蒙新材料科技(上海)有限公司 | 2021-04-09 | — | — | CN | claimed |
| WO-2024224871-A1 | CONDUCTIVE RESIN COMPOSITION | サカタインクス株式会社 | 2024-10-31 | — | — | WO | disclosed |
| CN-107868646-B | Conductive adhesive and conductive material | 日亚化学工业株式会社 | 2022-03-01 | — | — | CN | disclosed |
| CN-112625469-A | High-temperature-resistant metal plate adopting inorganic coating and preparation method thereof | 舾蒙新材料科技(上海)有限公司 | 2021-04-09 | — | — | CN | disclosed |
| CN-112625470-A | Normal-temperature curing inorganic coating and preparation method thereof | 舾蒙新材料科技(上海)有限公司 | 2021-04-09 | — | — | CN | disclosed |
| CN-112625468-A | Multifunctional composite coating and preparation method thereof | 舾蒙新材料科技(上海)有限公司 | 2021-04-09 | — | — | CN | disclosed |
| CN-112625467-A | Self-demoulding mould and preparation method thereof | 舾蒙新材料科技(上海)有限公司 | 2021-04-09 | — | — | CN | disclosed |
| US-9745406-B2 | Curable composition | CEMEDINE CO., LTD. (JP) | 2017-08-29 | — | — | US | disclosed |
| CN-106380894-A | Nonmetal powdery auxiliary agent | 廖煜明 | 2017-02-08 | — | — | CN | disclosed |
| EP-2093252-A1 | Curing composition and method for producing curing composition | CEMEDINE CO., LTD. (JP) | 2009-08-26 | — | — | EP | disclosed |
| US-20090118401-A1 | Curable Composition | CEMEDINE CO., LTD. (JP) | 2009-05-07 | — | — | US | disclosed |
| US-7256496-B2 | Semiconductor device having adhesion increasing film to prevent peeling | CASIO COMPUTER CO., LTD. (JP) | 2007-08-14 | — | — | US | disclosed |
| US-20060293456-A1 | Curable composition and method for producing the same | CEMEDINE CO., LTD. (JP) | 2006-12-28 | — | — | US | disclosed |
| EP-1650257-A1 | CURING COMPOSITION AND METHOD FOR PRODUCING CURING COMPOSITION | CEMEDINE CO., LTD. (JP) | 2006-04-26 | — | — | EP | disclosed |
| US-20050269698-A1 | Semiconductor device having adhesion increasing film and method of fabricating the same | CASIO COMPUTER CO., LTD. (JP) | 2005-12-08 | — | — | US | disclosed |
| US-5068304-A | Hydrolyzable silyl group containing polyether compound as a curable component joined by urethane groups capable of forming a rubber like substance | ASAHI GLASS COMPANY, LTD. (JP) | 1991-11-26 | — | — | US | disclosed |
| EP-0372561-A2 | Moisture-curable resin composition | ASAHI GLASS COMPANY LTD. (JP) | 1990-06-13 | — | — | EP | disclosed |