Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA12 | O43570 | 5/20 | 0.46 |
| ▸ | CA6 | P23280 | 5/20 | 0.46 |
| ▸ | CA7 | P43166 | 5/20 | 0.46 |
| ▸ | CA9 | Q16790 | 5/20 | 0.46 |
| ▸ | CA14 | Q9ULX7 | 5/20 | 0.46 |
| ▸ | CA5B | Q9Y2D0 | 5/20 | 0.46 |
| ▸ | CA2 | P00918 | 4/20 | 0.46 |
| ▸ | CA4 | P22748 | 4/20 | 0.46 |
| ▸ | CA5A | P35218 | 4/20 | 0.46 |
| ▸ | CA3 | P07451 | 3/20 | 0.46 |
| ▸ | MEN1 | O00255 | 2/20 | 0.43 |
| ▸ | RECQL | P46063 | 2/20 | 0.43 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.43 |
| ▸ | LMNA | P02545 | 3/20 | 0.42 |
| ▸ | TDP1 | Q9NUW8 | 3/20 | 0.42 |
| ▸ | ALOX15 | P16050 | 3/20 | 0.42 |
| ▸ | CA1 | P00915 | 2/20 | 0.42 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.42 |
| ▸ | TP53 | P04637 | 1/20 | 0.42 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL687888 | 0.83 | CA12 (0.46) | CA12CA6CA7CA9CA14 | |
| SCHEMBL449731 | 0.80 | CA12 (0.48) | CA12CA6CA7CA9CA14 | |
| SCHEMBL8916156 | 0.79 | CA12 (0.42) | CA12CA6CA7CA9CA14 | |
| SCHEMBL15289732 | 0.79 | CA12 (0.42) | CA12CA6CA7CA9CA14 | |
| SCHEMBL23579510 | 0.79 | CA12 (0.38) | CA12CA6CA7CA9CA14 | |
| SCHEMBL7712211 | 0.79 | — | — | |
| SCHEMBL6510548 | 0.78 | CA12 (0.48) | CA12CA6CA7CA9CA14 | |
| SCHEMBL28553596 | 0.78 | CA12 (0.41) | CA12CA6CA7CA9CA14 | |
| SCHEMBL16405942 | 0.77 | CA12 (0.37) | CA12CA6CA7CA9CA14 | |
| SCHEMBL29160666 | 0.77 | CA12 (0.37) | CA12CA6CA7CA9CA14 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 50 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117299098-B | High-performance titanium-based lithium adsorbent and preparation method and application thereof | 万华化学集团股份有限公司 | 2024-02-27 | — | — | CN | claimed |
| CN-117299098-A | High-performance titanium-based lithium adsorbent and preparation method and application thereof | 万华化学集团股份有限公司 | 2023-12-29 | — | — | CN | claimed |
| EP-0541074-A2 | Non-pollution sealant compound | SUNRISE MEISEI CORPORATION (JP) | 1993-05-12 | — | — | EP | claimed |
| WO-2024224871-A1 | CONDUCTIVE RESIN COMPOSITION | サカタインクス株式会社 | 2024-10-31 | — | — | WO | disclosed |
| CN-117299098-B | High-performance titanium-based lithium adsorbent and preparation method and application thereof | 万华化学集团股份有限公司 | 2024-02-27 | — | — | CN | disclosed |
| CN-117299098-A | High-performance titanium-based lithium adsorbent and preparation method and application thereof | 万华化学集团股份有限公司 | 2023-12-29 | — | — | CN | disclosed |
| CN-107868646-B | Conductive adhesive and conductive material | 日亚化学工业株式会社 | 2022-03-01 | — | — | CN | disclosed |
| CN-104449524-B | Wood floors part one pack system room temperature moisture curable adhesive composite | 施敏打硬株式会社 | 2018-09-11 | — | — | CN | disclosed |
| US-10073405-B2 | Image forming apparatus | FUJI XEROX CO., LTD. (JP) | 2018-09-11 | — | — | US | disclosed |
| US-20170351210-A1 | IMAGE FORMING APPARATUS | FUJI XEROX CO., LTD. (JP) | 2017-12-07 | — | — | US | disclosed |
| US-9745406-B2 | Curable composition | CEMEDINE CO., LTD. (JP) | 2017-08-29 | — | — | US | disclosed |
| US-6440519-B1 | FAST CURE SPEED AND SUPERIOR ADHESION UNDER HIGH TEMPERATURE-HIGH HUMIDITY CONDITIONS AND METAL CORROSION PROPERTIES | DSM N.V. (NL) | 2002-08-27 | — | — | US | disclosed |
| EP-0960355-A1 | PHOTOCURABLE RESIN COMPOSITION | DSM N.V. (NL) | 1999-12-01 | — | — | EP | disclosed |
| WO-1998036325-A1 | PHOTOCURABLE RESIN COMPOSITION | DSM N.V. (NL) | 1998-08-20 | — | — | WO | disclosed |
| EP-0391226-B1 | Method for manufacturing layer-built material with silicon dioxide film containing organic colorant and the layer-built material manufactured thereby | NIPPON SHEET GLASS CO LTD (JP) | 1994-07-13 | — | — | EP | disclosed |
| US-5232781-A | Method for manufacturing layer-built material with silicon dioxide film containing organic colorant and the layer-built material manufactured thereby | NIPPON SHEET GLASS CO., LTD. (JP) | 1993-08-03 | — | — | US | disclosed |
| US-5114760-A | Saturation of silicon dioxide with hydrosilicofluoric acid and treating with an organic color | NIPPON SHEET GLASS CO., LTD. (JP) | 1992-05-19 | — | — | US | disclosed |
| US-5068304-A | Hydrolyzable silyl group containing polyether compound as a curable component joined by urethane groups capable of forming a rubber like substance | ASAHI GLASS COMPANY, LTD. (JP) | 1991-11-26 | — | — | US | disclosed |
| EP-0391226-A1 | Method for manufacturing layer-built material with silicon dioxide film containing organic colorant and the layer-built material manufactured thereby | NIPPON SHEET GLASS CO. LTD. (JP) | 1990-10-10 | — | — | EP | disclosed |
| EP-0372561-A2 | Moisture-curable resin composition | ASAHI GLASS COMPANY LTD. (JP) | 1990-06-13 | — | — | EP | disclosed |