SCHEMBL23838003

SCHEMBL23838003

CCN(CC)C(=O)C(CC(C)(C)C)C(C)(C)C

nearest known ligand 0.41

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
DPP4 P27487 1/20 0.41
MEN1 O00255 1/20 0.35
GAA P10253 1/20 0.35
HTT P42858 1/20 0.35
KMT2A Q03164 1/20 0.35
LMNA P02545 2/20 0.32
MMP1 P03956 1/20 0.31
MMP2 P08253 1/20 0.31
MMP3 P08254 1/20 0.31
MMP8 P22894 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
ALDH1A1 P00352 1/20 0.30
RECQL P46063 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12281964 0.84 DPP4 (0.35) DPP4MEN1GAAHTTKMT2A
SCHEMBL23008567 0.83 MLYCD (0.40) DPP4
SCHEMBL24406354 0.81 CA12 (0.41) DPP4GAAMMP1MMP2MMP3
SCHEMBL20032257 0.79 DPP4 (0.41) DPP4MEN1GAAHTTKMT2A
SCHEMBL4400573 0.78 DPP4 (0.32) DPP4
SCHEMBL14159296 0.78 DPP4 (0.32) DPP4
SCHEMBL14584343 0.78 CA12 (0.38) MMP1MMP2MMP3MMP8
SCHEMBL14065634 0.78 CA12 (0.38) MMP1MMP2MMP3MMP8
SCHEMBL12281385 0.78 DPP4 (0.40) DPP4HTTLMNAMMP1MMP2
SCHEMBL22847874 0.77

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230352310-A1 CHEMICAL MECHANICAL POLISHING METHOD AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAME SAMSUNG ELECTRONICS., LTD. (KR) 2023-11-02 US disclosed
US-20230265346-A1 LIQUID CRYSTAL COMPOSITION, OPTICALLY ANISOTROPIC LAYER, LAMINATE, AND IMAGE DISPLAY DEVICE FUJIFILM CORPORATION (JP) 2023-08-24 US disclosed
US-20220145009-A1 COLORING RESIN COMPOSITION, FILM, COLOR FILTER, SOLID-STATE IMAGING ELEMENT, AND IMAGE DISPLAY DEVICE FUJIFILM CORPORATION (JP) 2022-05-12 US disclosed
EP-3686225-B1 PHOTOSENSITIVE COMPOSITION, IMAGE FORMING METHOD, FILM FORMING METHOD, RESIN, IMAGE, AND FILM FUJIFILM CORP (JP) 2021-09-22 EP disclosed