SCHEMBL23909527

SCHEMBL23909527

N#Cc1cccc2cccc(C(=O)Cl)c12

nearest known ligand 0.41

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
CA1 P00915 2/20 0.41
CA2 P00918 2/20 0.41
HSD17B10 Q99714 1/20 0.39
ALDH1A1 P00352 3/20 0.37
ALOX15 P16050 1/20 0.37
POLB P06746 3/20 0.35
HPGD P15428 2/20 0.35
MAPT P10636 2/20 0.35
HTT P42858 2/20 0.35
KDM4E B2RXH2 1/20 0.35
TDP1 Q9NUW8 1/20 0.35
KAT6A Q92794 1/20 0.35
L3MBTL1 Q9Y468 1/20 0.34
HSP90AA1 P07900 1/20 0.34
LMNA P02545 1/20 0.34
MCL1 Q07820 1/20 0.33
MAP2K1 Q02750 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11783850 0.84 HSD17B10 (0.58) CA1CA2HSD17B10ALDH1A1ALOX15
SCHEMBL23307972 0.82 CA1 (0.41) CA1CA2HSD17B10ALDH1A1POLB
SCHEMBL29868398 0.80 HSD17B10 (0.50) HSD17B10ALDH1A1ALOX15POLBHPGD
SCHEMBL1791928 0.80 HSD17B10 (0.50) HSD17B10ALDH1A1ALOX15POLBHPGD
SCHEMBL1340299 0.79 ALDH1A1 (0.48) CA1CA2ALDH1A1ALOX15POLB
SCHEMBL4607896 0.78 HSD17B10 (0.48) HSD17B10ALDH1A1ALOX15POLBHPGD
SCHEMBL11784891 0.78 ALDH1A1 (0.46) HSD17B10ALDH1A1POLBHPGDMAPT
Hydrochloric Acid SCHEMBL28252892 0.77 ALDH1A1 (0.47) CA1CA2ALDH1A1ALOX15POLB
SCHEMBL23909606 0.76 CA1 (0.42) CA1CA2ALDH1A1ALOX15POLB
SCHEMBL11446278 0.76 TSHR (0.41) ALDH1A1ALOX15POLBHPGDMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113527680-B Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2023-04-28 CN disclosed
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed