SCHEMBL23909553

SCHEMBL23909553

COC(=O)c1cccc2cccc(C(=O)Cl)c12

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 4/20 0.50
MAPT P10636 4/20 0.50
TDP1 Q9NUW8 1/20 0.50
TSHR P16473 2/20 0.47
LMNA P02545 1/20 0.47
ALDH1A1 P00352 3/20 0.46
CFTR P13569 1/20 0.46
HSD17B10 Q99714 1/20 0.46
POLB P06746 1/20 0.44
ATM Q13315 1/20 0.44
SLC6A4 P31645 2/20 0.44
SLC6A3 Q01959 2/20 0.44
SLC6A2 P23975 1/20 0.44
KMT2A Q03164 2/20 0.43
NPSR1 Q6W5P4 2/20 0.43
NR4A2 P43354 1/20 0.43
MEN1 O00255 1/20 0.43
HTT P42858 1/20 0.43
MAPK10 P53779 1/20 0.43
PTK2B Q14289 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30362305 1.00 KDM4E (0.50) KDM4EMAPTTDP1TSHRLMNA
SCHEMBL68712 0.91 KDM4E (0.58) KDM4EMAPTTDP1TSHRLMNA
SCHEMBL29576400 0.91 KDM4E (0.58) KDM4EMAPTTDP1TSHRLMNA
SCHEMBL13293021 0.85 TSHR (0.53) KDM4EMAPTTDP1TSHRLMNA
SCHEMBL29868398 0.84 HSD17B10 (0.50) KDM4EMAPTTDP1TSHRALDH1A1
SCHEMBL1791928 0.84 HSD17B10 (0.50) KDM4EMAPTTDP1TSHRALDH1A1
SCHEMBL7741670 0.84 HSD17B10 (0.58) KDM4EMAPTTDP1TSHRLMNA
SCHEMBL30363028 0.84 NR4A2 (0.59) KDM4EMAPTTDP1TSHRLMNA
SCHEMBL23909568 0.82 KDM4E (0.50) KDM4EMAPTTDP1TSHRLMNA
SCHEMBL11055939 0.81 MAPT (0.49) KDM4EMAPTTDP1TSHRLMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113527680-B Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2023-04-28 CN disclosed
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed