SCHEMBL23909568

SCHEMBL23909568

COC(=O)c1cccc2cccc(C(N)=O)c12

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 4/20 0.50
ALDH1A1 P00352 2/20 0.50
MAPT P10636 2/20 0.50
TDP1 Q9NUW8 1/20 0.50
CFTR P13569 1/20 0.50
HSD17B10 Q99714 1/20 0.50
TSHR P16473 2/20 0.47
LMNA P02545 1/20 0.47
SIRT2 Q8IXJ6 1/20 0.45
CA1 P00915 1/20 0.45
CA2 P00918 1/20 0.45
CA5A P35218 1/20 0.45
CA9 Q16790 1/20 0.45
POLB P06746 1/20 0.44
ATM Q13315 1/20 0.44
L3MBTL1 Q9Y468 1/20 0.44
SLC6A2 P23975 1/20 0.44
SLC6A4 P31645 1/20 0.44
SLC6A3 Q01959 1/20 0.44
PARP1 P09874 3/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL68712 0.91 KDM4E (0.58) KDM4EALDH1A1MAPTTDP1CFTR
SCHEMBL29576400 0.91 KDM4E (0.58) KDM4EALDH1A1MAPTTDP1CFTR
SCHEMBL13293021 0.85 TSHR (0.53) KDM4EALDH1A1MAPTTDP1CFTR
SCHEMBL157601 0.84 KDM4E (0.55) KDM4EALDH1A1MAPTTDP1HSD17B10
SCHEMBL7741670 0.84 HSD17B10 (0.58) KDM4EALDH1A1MAPTTDP1CFTR
SCHEMBL14837758 0.82 KDM4E (0.53) KDM4EALDH1A1MAPTTDP1HSD17B10
SCHEMBL30362305 0.82 KDM4E (0.50) KDM4EALDH1A1MAPTTDP1CFTR
SCHEMBL23909553 0.82 KDM4E (0.50) KDM4EALDH1A1MAPTTDP1CFTR
SCHEMBL11055939 0.81 MAPT (0.49) KDM4EALDH1A1MAPTTDP1CFTR
SCHEMBL3741831 0.80 TSHR (0.63) KDM4EALDH1A1MAPTTDP1CFTR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed