SCHEMBL23909571

SCHEMBL23909571

N#Cc1cccc2cc(C(N)=O)ccc12

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PARP1 P09874 6/20 0.44
PTPN1 P18031 1/20 0.42
HTT P42858 1/20 0.42
SLC9A1 P19634 2/20 0.42
LCK P06239 1/20 0.42
PARP15 Q460N3 2/20 0.41
PARP10 Q53GL7 2/20 0.41
PARP2 Q9UGN5 2/20 0.41
TNKS O95271 1/20 0.41
PARP14 Q460N5 1/20 0.41
TNKS2 Q9H2K2 1/20 0.41
CA1 P00915 1/20 0.41
CA2 P00918 1/20 0.41
ERN1 O75460 1/20 0.41
ALDH1A1 P00352 2/20 0.40
KDM4E B2RXH2 1/20 0.40
GAA P10253 1/20 0.40
MAPT P10636 1/20 0.39
HPGD P15428 1/20 0.39
PLAU P00749 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23909588 0.87 CA1 (0.45) PARP1PTPN1HTTSLC9A1LCK
SCHEMBL31525283 0.85 PTPN1 (0.60) PTPN1HTTCA1CA2ERN1
SCHEMBL4848179 0.85 PTPN1 (0.60) PTPN1HTTCA1CA2ERN1
SCHEMBL31347620 0.84 ALDH1A1 (0.58) PTPN1HTTCA1CA2ALDH1A1
SCHEMBL14209970 0.84 ALDH1A1 (0.58) PTPN1HTTCA1CA2ALDH1A1
SCHEMBL4847989 0.84 PTPN1 (0.42) PTPN1HTTSLC9A1CA1CA2
Hydrochloric Acid SCHEMBL4848001 0.84 PTPN1 (0.58) PTPN1HTTCA1CA2ERN1
SCHEMBL4840738 0.80 NCEH1 (0.45) PTPN1HTTCA1CA2ERN1
SCHEMBL6384957 0.76 ALDH1A1 (0.62) PARP1PTPN1SLC9A1LCKPARP15
SCHEMBL13045132 0.76 PARP1 (0.50) PARP1PTPN1SLC9A1LCKPARP15

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113527680-B Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2023-04-28 CN disclosed
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed