SCHEMBL23922190

SCHEMBL23922190

CC(C)COC(=O)CC(F)(F)F

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.42
ALDH1A1 P00352 1/20 0.38
TDP1 Q9NUW8 1/20 0.38
L3MBTL1 Q9Y468 1/20 0.38
GAA P10253 2/20 0.36
SMN1; SMN2 Q16637 2/20 0.36
MAPK1 P28482 1/20 0.36
NR1H3 Q13133 1/20 0.36
HTT P42858 1/20 0.35
PPARG P37231 1/20 0.33
NCOA2 Q15596 1/20 0.33
NCOA1 Q15788 1/20 0.33
NPSR1 Q6W5P4 1/20 0.33
NCOA3 Q9Y6Q9 1/20 0.33
POLB P06746 1/20 0.33
MAPT P10636 1/20 0.32
KDM4E B2RXH2 1/20 0.31
HPGD P15428 1/20 0.31
HSD17B10 Q99714 1/20 0.31
RAB9A P51151 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9936889 0.86 HTT (0.32) TSHRHTTMAPT
SCHEMBL9938019 0.83 MAPT (0.32) GAAHTTMAPT
SCHEMBL19857457 0.80 HTT (0.37) HTT
SCHEMBL6892214 0.80 TSHR (0.43) TSHRALDH1A1TDP1L3MBTL1GAA
SCHEMBL234737 0.80 TSHR (0.43) TSHRALDH1A1TDP1L3MBTL1GAA
SCHEMBL28192896 0.78 TSHR (0.42) TSHRALDH1A1TDP1L3MBTL1GAA
SCHEMBL31058602 0.78 TSHR (0.42) TSHRALDH1A1TDP1L3MBTL1GAA
SCHEMBL5972817 0.78 TSHR (0.42) TSHRALDH1A1TDP1L3MBTL1GAA
SCHEMBL2453871 0.77 TSHR (0.33) TSHRALDH1A1TDP1L3MBTL1GAA
SCHEMBL5972881 0.77 TSHR (0.41) TSHRALDH1A1TDP1L3MBTL1GAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230350294-A1 Negative Photosensitive Resin Composition, Patterning Process, Interlayer Insulating Film, Surface Protection Film, And Electronic Component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-11-02 US disclosed
US-11768434-B2 Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-26 US disclosed
US-11150556-B2 Polymer of polyimide precursor, positive type photosensitive resin composition, negative type photosensitive resin composition, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-19 US disclosed