SCHEMBL23928778

SCHEMBL23928778

Oc1ccc(-c2ccccc2Oc2ccccc2-c2ccc(O)cc2)cc1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ABL1 P00519 2/20 0.54
ABCB1 P08183 2/20 0.54
BCR P11274 2/20 0.54
ESR2 Q92731 3/20 0.48
BCL2L1 Q07817 2/20 0.48
MMP3 P08254 1/20 0.48
NCOA1 Q15788 1/20 0.46
NCOA3 Q9Y6Q9 1/20 0.46
ADRA2A P08913 1/20 0.44
ADRA2B P18089 1/20 0.44
ADRA2C P18825 1/20 0.44
ESR1 P03372 3/20 0.43
PTGS2 P35354 1/20 0.43
LTA4H P09960 1/20 0.43
NR1H2 P55055 1/20 0.43
BAX Q07812 1/20 0.43
FFAR4 Q5NUL3 1/20 0.41
KDM4E B2RXH2 1/20 0.41
MEN1 O00255 1/20 0.41
KMT2A Q03164 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28255018 0.90 NCOA1 (0.59) ABL1ABCB1BCRESR2BCL2L1
SCHEMBL16334735 0.88 PTGS2 (0.58) ABL1ABCB1BCRESR2BCL2L1
SCHEMBL2090173 0.84 FFAR4 (0.46) ABL1ABCB1BCRESR2FFAR4
SCHEMBL29810161 0.83 ABL1 (0.59) ABL1ABCB1BCRESR2ESR1
SCHEMBL28881735 0.83 ABL1 (0.50) ABL1ABCB1BCRESR2BCL2L1
SCHEMBL18593394 0.83 ABL1 (0.59) ABL1ABCB1BCRESR2ESR1
SCHEMBL11562948 0.82 ESR1 (0.52) ABL1ABCB1BCRESR2BCL2L1
SCHEMBL2097515 0.82 ABL1 (0.58) ABL1ABCB1BCRESR2NCOA1
SCHEMBL2059488 0.81 NCOA1 (0.59) BCL2L1NCOA1NCOA3PTGS2FFAR4
SCHEMBL2091589 0.80 ABL1 (0.71) ABL1ABCB1BCRESR2NCOA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20210332237-A1 POLYCARBONATE RESIN COMPOSITION, METHOD FOR PRODUCING THE SAME, MASTERBATCH PELLET, AND MOLDED BODY UBE MATERIAL INDUSTRIES, LTD. (JP) 2021-10-28 US disclosed