SCHEMBL23928939

SCHEMBL23928939

CO[Si](OC)(OC)C(C)[Si](OC)(OC)O[Si](OC)(OC)C(C)[Si](OC)(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL314498 0.89
SCHEMBL7612472 0.86
Methylamine SCHEMBL28360677 0.83
SCHEMBL5404837 0.76
SCHEMBL4356589 0.75
SCHEMBL331353 0.73
SCHEMBL5415618 0.73
SCHEMBL5414801 0.73
SCHEMBL21403436 0.73
SCHEMBL8837687 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11760903-B2 Adhesive composition, covering substrate, and cured product SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-19 US disclosed
EP-3907265-B1 ADHESIVE COMPOSITION, COVERED SUBSTRATE, AND CURED PRODUCT SHINETSU CHEMICAL CO (JP) 2022-09-28 EP disclosed
EP-3907265-A1 ADHESIVE COMPOSITION, COVERED SUBSTRATE, AND CURED PRODUCT Shin-Etsu Chemical Co., Ltd. (JP) 2021-11-10 EP disclosed
US-20210332265-A1 ADHESIVE COMPOSITION, COVERING SUBSTRATE, AND CURED PRODUCT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-28 US disclosed