SCHEMBL23966405

SCHEMBL23966405

Cc1ccc(Oc2ccc(N3C(=O)C4C5C=CC(O5)C4C3=O)cc2)cc1

nearest known ligand 0.64

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.64
ATM Q13315 2/20 0.64
CACNA1B Q00975 2/20 0.64
APBA1 Q02410 2/20 0.64
MAPT P10636 2/20 0.64
HPGD P15428 1/20 0.64
HTT P42858 1/20 0.64
HSD17B10 Q99714 1/20 0.64
TP53 P04637 1/20 0.49
SMN1; SMN2 Q16637 2/20 0.44
LMNA P02545 1/20 0.44
GAA P10253 1/20 0.44
ADCY2 Q08462 3/20 0.41
F2 P00734 1/20 0.41
ELANE P08246 1/20 0.41
CTSG P08311 1/20 0.41
CMA1 P23946 1/20 0.41
CTRC Q99895 1/20 0.41
KDM4E B2RXH2 1/20 0.40
MEN1 O00255 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1104580 0.91 ATM (0.69) ALDH1A1ATMCACNA1BAPBA1MAPT
SCHEMBL13186564 0.83 ALDH1A1 (0.69) ALDH1A1ATMCACNA1BAPBA1MAPT
SCHEMBL14345183 0.82 ATM (0.81) ALDH1A1ATMCACNA1BAPBA1MAPT
SCHEMBL12539789 0.80 TP53 (0.49) ALDH1A1ATMCACNA1BAPBA1MAPT
SCHEMBL13400450 0.78 TP53 (0.48) ALDH1A1ATMCACNA1BAPBA1MAPT
SCHEMBL13201654 0.78 ALDH1A1 (1.00) ALDH1A1ATMCACNA1BAPBA1MAPT
SCHEMBL12942231 0.78 ALDH1A1 (1.00) ALDH1A1ATMCACNA1BAPBA1MAPT
SCHEMBL12903449 0.78 ALDH1A1 (1.00) ALDH1A1ATMCACNA1BAPBA1MAPT
SCHEMBL12799504 0.78 TP53 (0.47) ALDH1A1ATMCACNA1BAPBA1MAPT
SCHEMBL13223600 0.78 TP53 (0.50) ALDH1A1ATMCACNA1BAPBA1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230221639-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN ASAHI KASEI KABUSHIKI KAISHA (JP) 2023-07-13 US disclosed
US-20230221639-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN ASAHI KASEI KABUSHIKI KAISHA (JP) 2023-07-13 US disclosed
US-11640112-B2 Photosensitive resin composition and method for producing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2023-05-02 US disclosed
US-11640112-B2 Photosensitive resin composition and method for producing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2023-05-02 US disclosed
US-20220011669-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN ASAHI KASEI KABUSHIKI KAISHA (JP) 2022-01-13 US disclosed
US-11163234-B2 Photosensitive resin composition and method for producing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2021-11-02 US disclosed