SCHEMBL2399665

SCHEMBL2399665

C=CC(/C=C\C)OC(=O)CC(C(=O)OC(C=C)/C=C\C)S(=O)(=O)O

nearest known ligand 0.34

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
RECQL P46063 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2399670 0.90
SCHEMBL325256 0.76 RECQL (0.33) RECQL
SCHEMBL1633303 0.73 TSHR (0.31)
SCHEMBL1633305 0.73 TSHR (0.31)
SCHEMBL4020730 0.70 RECQL (0.41) RECQL
SCHEMBL10340409 0.69 TSHR (0.37)
SCHEMBL10340407 0.69 TSHR (0.37)
SCHEMBL5411291 0.69 RECQL (0.45) RECQL
SCHEMBL8526917 0.68 RECQL (0.40) RECQL
SCHEMBL1257844 0.67 RECQL (0.39) RECQL

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024106276-A1 POLYMER FOR TEXTILE PRINTING INK, EMULSION FOR TEXTILE PRINTING INK CONTAINING SAID POLYMER, AND TEXTILE PRINTING INK 株式会社日本触媒 2024-05-23 WO disclosed
WO-2024070936-A1 CLEANING LIQUID FOR INKJET RECORDING DEVICES 株式会社日本触媒 2024-04-04 WO disclosed
CN-115003765-B Ink for inkjet 株式会社日本触媒 2023-11-28 CN disclosed
US-20230331888-A1 Resin Composition NIPPON SHOKUBAI CO., LTD. (JP) 2023-10-19 US disclosed
WO-2023162981-A1 ADDITIVE USED IN HYDRAULIC COMPOSITION FOR ADDITIVE MANUFACTURING 株式会社日本触媒 2023-08-31 WO disclosed
EP-4186939-A1 RESIN COMPOSITION Nippon Shokubai Co., Ltd. (JP) 2023-05-31 EP disclosed
CN-113365831-B Emulsion for aqueous ink, and ink composition for aqueous ink comprising same 株式会社日本触媒 2023-05-16 CN disclosed
CN-116134067-A Resin composition 株式会社日本触媒 2023-05-16 CN disclosed
US-20230094605-A1 RESIN EMULSION FOR WATER-BASED INK NIPPON SHOKUBAI CO., LTD. (JP) 2023-03-30 US disclosed
US-20220081577-A1 EMULSION FOR WATER-BASED INK AND INK COMPOSITION FOR WATER-BASED INK CONTAINING THE SAME NIPPON SHOKUBAI CO., LTD. (JP) 2022-03-17 US disclosed
EP-3915790-A1 EMULSION FOR AQUEOUS INK AND INK COMPOSITION FOR AQUEOUS INK CONTAINING SAME Nippon Shokubai Co., Ltd. (JP) 2021-12-01 EP disclosed
WO-2021153288-A1 RESIN EMULSION FOR WATER-BASED INK 株式会社日本触媒 2021-08-05 WO disclosed
WO-2021149548-A1 INK-JET INK 株式会社日本触媒 2021-07-29 WO disclosed
WO-2021024999-A1 EMULSION PARTICLE-CONTAINING AQUEOUS DISPERSION 株式会社日本触媒 2021-02-11 WO disclosed
CN-112105972-A Optical film, phase difference film, polarizing plate, and liquid crystal display device 柯尼卡美能达株式会社 2020-12-18 CN disclosed
US-9777162-B2 Waterborne curable resin composition NIPPON SHOKUBAI CO., LTD. (JP) 2017-10-03 US disclosed
US-8741985-B2 Resin emulsion for sealer NIPPON SHOKUBAI CO., LTD. (JP) 2014-06-03 US disclosed
US-20110224352-A1 RESIN EMULSION FOR SEALER NIPPON SHOKUBAI CO., LTD. (JP) 2011-09-15 US disclosed
US-20080214694-A1 acrylic emulsion; UV-curable monomer; dispersion stability; without use of a film-forming assistant; durability, stain resistance; paint, automobile finishes, films; cycloalkyl acrylic monomer; cyclohexyl methacrylate NIPPON SHOKUBAL CO., LTD (JP) 2008-09-04 US disclosed
WO-2007037559-A9 WATERBORNE CURABLE RESIN COMPOSITION NIPPON CATALYTIC CHEM IND (JP) 2007-05-31 WO disclosed