SCHEMBL240232

SCHEMBL240232

O=C1C=CC(=O)N1C(c1ccccc1)(c1ccccc1)N1C(=O)C=CC1=O

nearest known ligand 0.44

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 13/20 0.44
TLR9 Q9NR96 1/20 0.41
GSK3A P49840 3/20 0.40
GSK3B P49841 3/20 0.40
HSP90AA1 P07900 3/20 0.40
ALDH1A1 P00352 3/20 0.40
HTT P42858 2/20 0.40
ATM Q13315 2/20 0.40
HPGD P15428 1/20 0.40
XBP1 P17861 1/20 0.40
ALOX12 P18054 1/20 0.40
RUNX1 Q01196 1/20 0.40
CBFB Q13951 1/20 0.40
FAAH O00519 3/20 0.39
PKM P14618 1/20 0.35
TSHR P16473 2/20 0.35
KCNN4 O15554 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6368612 0.81 MGLL (0.44) MGLLTLR9GSK3AGSK3BHSP90AA1
SCHEMBL29387747 0.76 MGLL (0.50) MGLLHSP90AA1ALDH1A1FAAH
SCHEMBL31564891 0.73 MGLL (0.56) MGLLGSK3AGSK3BALDH1A1
SCHEMBL9562548 0.73 MGLL (0.40) MGLLTLR9GSK3AGSK3BHSP90AA1
SCHEMBL18872351 0.71 MGLL (0.39) MGLLTLR9GSK3AGSK3BHSP90AA1
SCHEMBL1078397 0.69 CES1 (0.42) MGLLTLR9HSP90AA1ALDH1A1HTT
SCHEMBL1824378 0.68 CYP2C19 (0.37) MGLLGSK3AGSK3BHSP90AA1ALDH1A1
SCHEMBL27975664 0.67 MGLL (0.40) MGLLTLR9GSK3AGSK3BHSP90AA1
SCHEMBL22862096 0.66 MGLL (0.65) MGLLHSP90AA1ALDH1A1HTTATM
SCHEMBL5889438 0.62 MGLL (0.35) MGLLTLR9GSK3AGSK3BHSP90AA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 177 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119264155-A Latent curing agent based on dynamic crosslinking-controllable dissolution mechanism 江南大学 2025-01-07 CN claimed
CN-117645771-A Solvent-free high-low temperature resistant bulletproof composite matrix resin and preparation method thereof 上海鑫丰泰新材料科技有限公司 2024-03-05 CN claimed
WO-2022132359-A1 CURABLE COMPOSITION FOR MAKING CURED LAYER WITH HIGH THERMAL STABILITY CANON KABUSHIKI KAISHA (JP) 2022-06-23 WO claimed
EP-4013810-A1 THERMALLY EXPANDABLE COMPOSITIONS COMPRISING A CHEMICAL BLOWING AGENT Sika Technology AG (CH) 2022-06-22 EP claimed
CN-109982993-B Asymmetrically substituted dienyl diphenyl ethers, their preparation and use 赢创运营有限公司 2022-06-07 CN claimed
CN-108349861-B Alkenylphenoxy-substituted 1, 1-diphenylethylenes, process for their preparation and their use 赢创运营有限公司 2021-07-20 CN claimed
WO-2021028599-A1 THERMALLY EXPANDABLE COMPOSITIONS COMPRISING A CHEMICAL BLOWING AGENT SIKA TECHNOLOGY AG (CH) 2021-02-18 WO claimed
CN-108137458-B [ (2-ethoxy-5-trans-1-propen-1-yl) -phenoxy ] -end-capping compounds 赢创运营有限公司 2021-01-05 CN claimed
WO-2020205098-A1 DISINTEGRATABLE BISMALEIMIDE COMPOSITES FOR DOWNHOLE TOOL APPLICATIONS BAKER HUGHES OILFIELD OPERATIONS LLC (US) 2020-10-08 WO claimed
WO-2009019311-A1 RESIN FORMULATION BASED ON BISMALEIMIDE FOR PRODUCING A FILM, PRODUCTION OF A FILM USING THE RESIN FORMULATION AND USE OF THE FILM SIEMENS AKTIENGESELLSCHAFT (DE) 2009-02-12 WO claimed
EP-1697426-A1 ADHERENT, MODIFIED THERMOPLASTIC ELASTOMERIC BLENDS, ARTICLES, AND METHODS Solvay Engineered Polymers, Inc. (US) 2006-09-06 EP claimed
WO-2005061558-A1 ADHERENT, MODIFIED THERMOPLASTIC ELASTOMERIC BLENDS, ARTICLES, AND METHODS SOLVAY ENGINEERED POLYMERS, INC. (US) 2005-07-07 WO claimed
WO-1998030374-A1 PROCESS FOR PREPARING PREFORMS AND MOLDED ARTICLES THE DOW CHEMICAL COMPANY (US) 1998-07-16 WO claimed
EP-0318162-A2 Novel bismaleimide derivatives TEXACO DEVELOPMENT CORPORATION (US) 1989-05-31 EP claimed
JP-7048510-A None JP disclosed
US-12390987-B2 Hybrid resin composition for the 3D-printing of objects CUBICURE GMBH (AT) 2025-08-19 US disclosed
CN-120025660-A Resin composition and use thereof 台燿科技股份有限公司 2025-05-23 CN disclosed
EP-0102722-A1 Modified thermosetting imide resins The Boots Company PLC (GB) 1984-03-14 EP disclosed
WO-1984000552-A1 MODIFIED THERMOSETTING IMIDE RESINS BOOTS CO PLC (GB) 1984-02-16 WO disclosed
US-3996203-A Solution process for the preparation of polyimides from diamines and anhydrides GENERAL ELECTRIC COMPANY (US) 1976-12-07 US disclosed