SCHEMBL2403160

SCHEMBL2403160

CC(=CCCC(C)(C)O)C(=O)O

nearest known ligand 0.41

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
CD81 P60033 2/20 0.41
ALDH1A1 P00352 2/20 0.38
ALOX15 P16050 2/20 0.36
PPARG P37231 1/20 0.33
ACLY P53396 1/20 0.31
BACE1 P56817 1/20 0.31
HMGCR P04035 1/20 0.31
CHRM1 P11229 1/20 0.31
TBXA2R P21731 1/20 0.31
ADRA1A P35348 1/20 0.31
TSHR P16473 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3622962 0.84 CD81 (0.39) CD81ALOX15PPARGACLYBACE1
Menthiafolic Acid SCHEMBL28864402 0.80 ALOX15 (0.63) CD81ALOX15PPARG
Menthiafolic Acid SCHEMBL1812046 0.80 ALOX15 (0.63) CD81ALOX15PPARG
Menthiafolic Acid SCHEMBL1812045 0.80 ALOX15 (0.63) CD81ALOX15PPARG
SCHEMBL23522254 0.79 CD81 (0.39) CD81ALOX15PPARGBACE1
SCHEMBL9498890 0.79 CD81 (0.36) CD81ALOX15PPARGBACE1
SCHEMBL3241642 0.78 CD81 (0.37) CD81PPARGBACE1
SCHEMBL16318694 0.78 CD81 (0.38) CD81PPARGACLYBACE1
SCHEMBL676135 0.78 CD81 (0.37) CD81PPARGBACE1
SCHEMBL9113174 0.78 CD81 (0.37) CD81PPARGBACE1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12002385-B2 Laminate and label NIPPON CARBIDE INDUSTRIES CO., INC. (JP) 2024-06-04 US disclosed
US-20220044596-A1 LAMINATE AND LABEL NIPPON CARBIDE INDUSTRIES CO., INC. (JP) 2022-02-10 US disclosed
EP-3901937-A1 LAMINATE AND LABEL Nippon Carbide Industries Co., Inc. (JP) 2021-10-27 EP disclosed
US-20160083634-A1 CURABLE COMPOSITION AND JOINT STRUCTURE PRODUCED USING SAME SEKISUI FULLER COMPANY, LTD. (JP) 2016-03-24 US disclosed
US-20150315305-A1 Paste Composition, and Calcined Body and Production Process for the Same SOKEN CHEMICAL & ENGINEERING CO., LTD. (JP) 2015-11-05 US disclosed
US-8927071-B2 Pressure-sensitive adhesive composition, pressure-sensitive adhesive and optical film NIPPON CARBIDE INDUSTRIES CO., INC. (JP) 2015-01-06 US disclosed
US-8846197-B2 Impact-absorbing pressure-sensitive adhesive sheet and method of producing the same NITTO DENKO CORPORATION (JP) 2014-09-30 US disclosed
US-8673412-B2 Adhesive composition for polarizing plates, polarizing plate with adhesive using same, and liquid crystal display device using same NIPPON CARBIDE INDUSTRIES CO., INC. (JP) 2014-03-18 US disclosed
US-20130040075-A1 ADHESIVE COMPOSITION FOR POLARIZING PLATES, POLARIZING PLATE WITH ADHESIVE USING SAME, AND LIQUID CRYSTAL DISPLAY DEVICE USING SAME NIPPON CARBIDE INDUSTRIES CO., INC. (JP) 2013-02-14 US disclosed
US-8217096-B2 Photocurable pressure-sensitive adhesive composition SEKISUI CHEMICAL CO., LTD. (JP) 2012-07-10 US disclosed
US-20110236605-A1 PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE AND OPTICAL FILM NIPPON CARBIDE INDUSTRIES CO., INC. (JP) 2011-09-29 US disclosed
US-7812902-B2 Liquid crystal panel and liquid crystal display apparatus NITTO DENKO CORPORATION (JP) 2010-10-12 US disclosed
US-7767753-B2 Binder resin composition, paste and green sheet SEKISUI CHEMICAL CO., LTD. (JP) 2010-08-03 US disclosed
US-20100184880-A1 PHOTOCURABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION SEKISUI CHEMICAL CO., LTD. (JP) 2010-07-22 US disclosed
US-20100157205-A1 LIQUID CRYSTAL PANEL AND LIQUID CRYSTAL DISPLAY APPARATUS NITTO DENKO CORPORATION (JP) 2010-06-24 US disclosed
US-20080227918-A1 Paint Composition, a Method of Paint Finishing and Painted Objects BASF COATINGS JAPAN LIMITED (JP) 2008-09-18 US disclosed
US-20080050584-A1 IMPACT-ABSORBING PRESSURE-SENSITIVE ADHESIVE SHEET AND METHOD OF PRODUCING THE SAME NITTO DENKO CORPORATION (JP) 2008-02-28 US disclosed
US-20070249770-A1 Binder Resin Composition, Paste and Green Sheet SEKISUI CHEMICAL CO., LTD. (JP) 2007-10-25 US disclosed
US-7135518-B2 Curable compositions, sealing material, and adhesive SEKISUI CHEMICAL CO., LTD. (JP) 2006-11-14 US disclosed
US-6465537-B1 TACKIFYING POLYMER VIA RADICAL POLYMERIZATION WHICH RAPIDLY CURES VIA CATIONIC POLYMERIZATION; ETHYLENICALLY UNSATURATED COMPOUND, EPOXY RESIN, FREE RADICAL AND CATIONIC CATALYSTS AND A CROWN ETHER SEKISUI CHEMICAL CO., LTD. (JP) 2002-10-15 US disclosed