SCHEMBL24058

SCHEMBL24058

[SiH3]N[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL647704 0.89
SCHEMBL30089771 0.89
SCHEMBL6821289 0.89
SCHEMBL8954208 0.89
Potassium SCHEMBL30089768 0.89
SCHEMBL9015942 0.89
SCHEMBL18489985 0.89
SCHEMBL9562195 0.89
SCHEMBL6821294 0.89
SCHEMBL1299856 0.89

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 35838 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4748481-A1 METHOD FOR TREATING EXHAUST GAS Covestro Deutschland AG (DE) 2026-05-27 EP claimed
CN-122071591-A Use of surface-modified titanium dioxide powder as additive for improving electrical properties of polypropylene high-voltage cable nanocomposites 赢创运营有限公司 2026-05-22 CN claimed
US-20260139200-A1 COMPOSITIONS AND METHODS FOR VAPOR PHASE SURFACE MODIFICATION FUJIFILM ELECTRONIC MAT U S A INC (US) 2026-05-21 US claimed
US-20260129893-A1 OXIDE FILM COATING SOLUTION AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2026-05-07 US claimed
US-20260098105-A1 PREPOLYMERIZED CATALYST FOR OLEFIN POLYMERIZATION, METHOD OF PRODUCING THIS PREPOLYMERIZED CATALYST AND METHOD OF PRODUCING OLEFIN POLYMER WITH IMPROVED PROCESSABILITY AND OPTICAL PROPERTIES FORMOSA PLASTICS CORPORATION, U.S.A. (US) 2026-04-09 US claimed
EP-4378882-B1 MICROMECHANICAL ENVIRONMENTAL BARRIER CHIP AND METHOD FOR MANUFACTURING SAME INFINEON TECHNOLOGIES AG (DE) 2026-04-01 EP claimed
US-12570883-B2 Sealant composition DOW SILICONES CORPORATION (US) 2026-03-10 US claimed
US-12543337-B2 Oxide film coating solution and semiconductor device manufacturing method using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2026-02-03 US claimed
EP-4077576-B1 SEALANT COMPOSITION DOW SILICONES CORP (US) 2026-01-14 EP claimed
US-20250366087-A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) 2025-11-27 US claimed
US-4152487-A ALLOYS, POLYSILICATES NIPPON ELECTRIC CO., LTD. (JP) 1979-05-01 US claimed
US-4148937-A BUTADIENE-STYRENE COPOLYMER CANON KABUSHIKI KAISHA (JP) 1979-04-10 US claimed
US-4116919-A SILAZANES DOW CORNING CORPORATION (US) 1978-09-26 US claimed
US-4061609-A POLYSILOXANE GENERAL ELECTRIC COMPANY (US) 1977-12-06 US claimed
US-4043969-A Casting compound for semiconductor devices NATIONAL SEMICONDUCTOR CORPORATION (US) 1977-08-23 US claimed
US-4041010-A FLUORINATED VINYL-CONTAINING SILICONE RESIN WITH HYDROGEN-CONTAINING POLYSILOXANE AS CROSSLINKING POLYMER GENERAL ELECTRIC COMPANY (US) 1977-08-09 US claimed
US-4029629-A Solvent resistant room temperature vulcanizable silicone rubber composition GENERAL ELECTRIC COMPANY (US) 1977-06-14 US claimed
US-3975757-A INTEGRATED CIRCUITS ENCAPSULATED IN EPOXIDIZED NOVOLAK RESIN NATIONAL SEMICONDUCTOR CORPORATION (US) 1976-08-17 US claimed
US-3957713-A High strength organopolysiloxane compositions GENERAL ELECTRIC COMPANY (US) 1976-05-18 US claimed
US-3931067-A HYDROPHOBIC MICROPOROUS MATERIALS AND PROCESS FOR PRODUCING SAME AMERACE CORPORATION (US) 1976-01-06 US claimed